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Semiconductor chip surface polishing device

A technology of surface polishing and polishing device, applied in surface polishing machine tools, grinding/polishing equipment, grinding machines, etc., can solve the problems of no working surface, vibration of the chip, low degree of automation, etc., to reduce the impact effect and reduce the impact Effect

Inactive Publication Date: 2021-04-13
南京库森科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the degree of automation of semiconductor chip polishing devices is low, and there may be vibration for chips with uneven surfaces, and there is no device for removing abrasive debris and static electricity on the working surface.

Method used

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  • Semiconductor chip surface polishing device
  • Semiconductor chip surface polishing device
  • Semiconductor chip surface polishing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0022] Example: such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Image 6 Shown is a semiconductor chip surface polishing device. The support frame 1 is the installation platform for the turntable feeding device 2, the surface polishing device 3, and the dust removal and static removal device 4. The turntable motor 201 is fixedly installed on the support frame 1, and the turntable 202 is rotatably installed on the support frame 1. The turntable 202 and the turntable motor The output shaft of 201 is fixedly connected, the feeding belt 209 is fixedly installed on the support frame 1, the stage support 211 is fixedly installed on the support frame 1, the stop rod bracket 212 is fixedly installed on the support frame 1, and the discharge belt 213 is fixedly installed on the support frame 1. On the support frame 1 , the polishing device base 311 is fixedly mounted on the support frame 1 , the hydraulic cylinder 401 is fixedly mounted on the support frame 1 , a...

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PUM

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Abstract

The invention discloses a semiconductor chip surface polishing device, and relates to the technical field of semiconductor device production equipment. The semiconductor chip surface polishing device comprises a supporting frame, a rotary disc feeding device, a surface polishing device and a chip removing and static electricity removing device, wherein the supporting frame is used for supporting all other devices; the rotary disc feeding device is used for feeding and discharging and conveying a chip to the polishing device and the chip removing and static electricity removing device; the surface polishing device is used for surface polishing treatment of the chip; and the chip and static electricity removing device is used for removing abrasive dust and possible static electricity of an objective table. The semiconductor chip surface polishing device has the beneficial effects that chips with different thicknesses can be operated, the anti-vibration effect on uneven surfaces is achieved, an integrated feeding and discharging system is provided, and the automation degree is high.

Description

technical field [0001] The invention relates to the technical field of semiconductor device production equipment, in particular to a semiconductor chip surface polishing device. Background technique [0002] The emergence of semiconductors has led the way in the information age. In recent years, with the rapid development of semiconductor chip manufacturing, some key technologies in the semiconductor chip manufacturing process have also attracted people's attention. Surface polishing is an important step in the semiconductor chip manufacturing process. , the automated production of its process will gradually come into people's field of vision. At present, the degree of automation of semiconductor chip polishing devices is low, and there may be vibrations when working on chips with uneven surfaces, and there is no device for removing abrasive debris and static electricity on the working surface. Contents of the invention [0003] In view of the above technical problems, th...

Claims

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Application Information

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IPC IPC(8): B24B29/02B24B27/00B24B41/00H05F3/00
CPCB24B27/0023B24B27/0069B24B29/02B24B41/005B24B41/007H05F3/00
Inventor 代旭
Owner 南京库森科技有限公司
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