High buffer insulating composite paperboard

A technology of composite board and paperboard, which is applied in the field of high-buffering and heat-insulating composite paperboard, can solve the problems that cannot meet the requirements, and the impact resistance of honeycomb paperboard has no function, so as to achieve good heat insulation and moisture-proof effect, reduce impact resistance and improve toughness Effect

Inactive Publication Date: 2015-04-29
正业包装(中山)有限公司
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the honeycomb paperboard used alone has no other functions except impact res

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High buffer insulating composite paperboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A high-buffer heat-insulating composite paperboard, comprising a honeycomb paperboard layer 1, a barrier film I2 is pasted on the honeycomb paperboard layer 1, a fiber fabric layer 3 is provided on the barrier film I2, a barrier film II4 is provided on the fiber fabric layer 3, and the barrier film II4 is coated with inorganic fiber coating I5, and the inorganic fiber coating I5 is covered with polylactic acid-aliphatic polyester composite foam board 6; the honeycomb paperboard layer 1 is coated with inorganic fiber coating II7, and the bottom of the inorganic fiber coating II7 Covered with polylactic acid-elastomer composite sheet 8 . The fiber fabric layer 3 is filled with nanocomposite suspension, which can improve the impact resistance of the composite board 8 .

[0024] The fiber fabric layer 3 is a double-layer structure woven with polyester fibers, and the mesh number of the holes is 400 mesh. The nanocomposite suspension comprises a dispersion medium and nanome...

Embodiment 2

[0034] A high-buffer heat-insulating composite paperboard, comprising a honeycomb paperboard layer 1, a barrier film I2 is pasted on the honeycomb paperboard layer 1, a fiber fabric layer 3 is provided on the barrier film I2, a barrier film II4 is provided on the fiber fabric layer 3, and the barrier film II4 is coated with inorganic fiber coating I5, and the inorganic fiber coating I5 is covered with polylactic acid-aliphatic polyester composite foam board 6; the honeycomb paperboard layer 1 is coated with inorganic fiber coating II7, and the bottom of the inorganic fiber coating II7 Covered with polylactic acid-elastomer composite sheet 8 . The fiber fabric layer 3 is filled with nanocomposite suspension, which can improve the impact resistance of the composite board 8 .

[0035] The fiber fabric layer 3 is a single-layer structure woven with viscose fibers, and the mesh number of the holes is 400 mesh. The nanocomposite suspension comprises a dispersion medium and nanomete...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Meshaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a high buffer insulating composite paperboard which comprises a honeycomb paperboard layer, wherein a barrier film I is attached to a honeycomb paperboard, a fiber fabric layer is arranged on the barrier film I, a barrier film II is arranged on the fiber fabric layer, the barrier film II is coated with an inorganic fiber coating I, and a polylactic acid-aliphatic polyester composite foaming board is arranged on the inorganic fibber coating I; an inorganic fiber coating II is arranged below the honeycomb paperboard, a polylactic acid-elastomer composite board is arranged below the inorganic fiber coating II, and the fiber fabric layer is filled with a nano composite suspension. The composite board disclosed by the invention has an excellent anti-impact buffering effect and a good insulating effect. Meanwhile, almost raw materials of the composite board are degradable materials, so that the composite paperboard has a good environment-friendly characteristic.

Description

technical field [0001] The invention relates to the field of environment-friendly composite honeycomb paperboard, in particular to a high-buffering and heat-insulating composite paperboard with excellent cushioning performance and heat insulation performance. Background technique [0002] In the field of plate preparation, especially in the field of high-end packaging plates, there are high requirements for the comprehensive performance of the plate. For example, the plate is required to have good mechanical properties to protect against the impact of external forces, and have good barrier properties to prevent internal packaging. Oxidation, good flame retardancy, etc. Although plastic panels have good and controllable properties, they are derived from petroleum resources and are difficult to degrade, which is likely to cause long-term pollution. Therefore, a variety of environmentally friendly boards have been developed, such as common wood-plastic boards, polylactic acid ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B32B3/12B32B27/10B32B27/30B32B27/12B32B27/36B32B7/12
CPCB32B3/12B32B5/18B32B7/12B32B27/10B32B27/12B32B27/30B32B27/36B32B33/00B32B2307/304B32B2307/558B32B2307/716
Inventor 罗礼发尹文欣李俊陈一
Owner 正业包装(中山)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products