Wafer cleaning device

Abstract

The invention discloses a wafer cleaning device. The wafer cleaning device comprises a rotary chamber, a rotating assembly, an electric sensor and a soft X-ray ionizer; the rotating assembly is arranged in the rotating chamber, the rotating assembly comprises a rotating table, and a suction cup is arranged on the rotating table and used for sucking a wafer so that the wafer can rotate along with rotation of the rotating table; the electrostatic sensor is used for sensing whether electrostatic charges exist on the wafer or not; and the soft X-ray ionizer is arranged above the wafer, and when the electrostatic sensor senses that the electrostatic charge exists on the wafer, the soft X-ray ionizer irradiates soft X-rays to the wafer to ionize air in the rotating chamber so as to eliminate the electrostatic charge on the wafer. By the mode, static electricity generated on the wafer can be effectively eliminated.

Description

technical field [0001] The invention relates to a wafer cleaning device. Background technique [0002] During the cleaning process of the wafer, when the spin chamber of the cleaning equipment is being processed, the spin chuck (Spin Chuck) rotates or the fluid flowing in the Teflon (Teflon) pipe will generate static electricity due to friction, but this static electricity will make the wafer The surface of the circle is covered with particles, which is prone to poor arcing during the wafer patterning process, which in turn leads to a decrease in the yield of the wafer. [0003] At present, static electricity is usually eliminated in the following ways. One is to install the wafer holder made of carbon material on the spin chuck and ground it, and the other is to spray carbon dioxide fluid on the wafer before processing using spray technology. However, in In practical application, it is found that the above-mentioned method does not solve the above-mentioned problem. Cont...

AI Technical Summary

Problems solved by technology

[0002] During the cleaning process of the wafer, when the spin chamber of the cleaning equipment is being processed, the spin chuck (Spin Chuck) rotates or the fluid flowing in the Teflon (Teflon) pipe will generate static electricity due to friction, but this static electricity will make the wafer The surface of the circle is covered with particles, which is prone to poor arcing during the wafer patterning process, resulting in a decrease in the yield of the wafer

[0003] At present, static electricity is usually eliminated in the following ways. One is to install the wafer holder made of carbon material on the spin chuck and ground it, and the other is to spray carbon dioxide fluid on the wafer before processing using spray technology. However, in In practical applications, it was found that the above methods did not solve the above problems

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