Silicon-based microphone and method for manufacturing same

A manufacturing method and microphone technology, applied in the field of microphones, can solve problems such as cracks and failure of the outer diaphragm, and achieve the effect of avoiding failure of rupture

Active Publication Date: 2021-04-20
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, during the performance test of the silicon-based microphone in the related art, for example, when the air is blown, the outer diaphragm is subjected to a large pressure, which causes cracks to appear on the outer diaphragm during the test, and rupture failure occurs

Method used

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  • Silicon-based microphone and method for manufacturing same
  • Silicon-based microphone and method for manufacturing same
  • Silicon-based microphone and method for manufacturing same

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Embodiment Construction

[0035] see figure 1 , is a schematic cross-sectional structure diagram of a silicon-based microphone provided by an embodiment of the present invention.

[0036] Embodiments of the present invention provide a silicon-based microphone and a manufacturing method thereof. Such as figure 1 The silicon-based microphone 1 shown includes a silicon substrate 10 , an insulating layer 20 , a vibrating membrane 30 and a back plate 40 which are sequentially stacked. The silicon-based microphone 1 also includes a back plate electrode 50 disposed on the side of the back plate facing the diaphragm.

[0037] Wherein, the silicon substrate 10 is used to carry the insulating layer 20 , the diaphragm 30 and the back plate 40 . The silicon substrate 10 includes a back cavity 101 .

[0038] The insulating layer 20 is disposed on the silicon substrate 10 . The insulating layer 20 can be made of silicon oxide material. Specifically, the insulating layer 20 is disposed between the silicon subst...

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PUM

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Abstract

The invention provides a silicon-based microphone, which comprises a silicon substrate with a back cavity, a vibrating diaphragm and a back plate, the vibrating diaphragm and the back plate are arranged above the silicon substrate, and the vibrating diaphragm comprises an inner vibrating diaphragm and an outer vibrating diaphragm which is positioned at the periphery of the inner vibrating diaphragm and is arranged at an interval with the inner vibrating diaphragm. The back plate comprises a back plate supporting body fixedly connected with the outer vibrating diaphragm, a back plate middle body supported by the back plate supporting body and located above the back cavity and a resisting column extending out from the back plate middle body towards the vibrating diaphragm, and when the vibrating diaphragm vibrates, the outer vibrating diaphragm can deform to abut against the resisting column. The silicon-based microphone provided by the invention has the advantage that the outer vibrating diaphragm is not easy to break under the action of large sound pressure.

Description

【Technical field】 [0001] The invention relates to a microphone, in particular to a silicon-based microphone. 【Background technique】 [0002] With the development of wireless communication, there are more and more mobile phone users around the world. The users' requirements for mobile phones are not only to be satisfied with calls, but also to be able to provide high-quality call effects. Especially with the development of mobile multimedia technology, mobile phones The call quality of the mobile phone is more important, and the microphone of the mobile phone is used as a voice pickup device of the mobile phone, and its design directly affects the call quality. Micro-Electro-Mechanical-System Microphones, also known as silicon-based microphones, are currently widely used and have better performance. Its packaging volume is smaller than that of traditional electret microphones, and its sensitivity is also higher, so it is more and more widely used. [0003] However, during t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R19/00H04R31/00H04R7/04H04R7/16
Inventor 钟晓辉王琳琳屠兰兰
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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