CNC machining method of metallized semi-pore board and numerical control machine tool adopted by CNC machining method of metallized semi-pore board

Abstract

The invention provides a CNC machining method of a metallized semi-pore board and a numerical control machine tool adopted by the CNC machining method of the metallized semi-pore board. The numerical control machine tool is improved, a right-handed rotation mode and a left-handed rotation mode are set, a right-handed rotation cutter is controlled through the right-handed rotation mode to achieve machining of right sides of semi-holes of a board, a left-handed rotation cutter is controlled through the left-handed rotation mode to cut the intersection positions of the left sides of the semi-holes and the portions which are not cut during primary cutting. Therefore, the effect of directly forming the metallized semi-pore board is achieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a CNC method for metallizing a half-hole plate and a numerically controlled machine tool used therein. Background technique [0002] Metallized half-hole plate is a commonly used design for connectors and module products. In the PCB processing process, a complete hole is drilled first, and after the metallization of the hole is completed, the unnecessary half is cut off by milling cutter cutting. hole. After the hole is metallized, there will be residual copper on the side of the half-hole when the tool is cutting. The current half-hole plate processing is basically CNC milling the half-hole after electroplating, and then etching is performed to etch the residual copper on the side of the half-hole. In this process, there are problems such as long process flow, half-hole ink entering during solder mask printing, and scratches on the board surface during ...

AI Technical Summary

Problems solved by technology

After the hole is metallized, there will be residual copper on the side of the half-hole when the tool is cutting. The current half-hole plate processing is basically CNC milling the half-hole after electroplating, and then etching is performed to etch the residual copper on the side of the half-hole. In this process, there are problems such as long process flow, half-hole ink entering during solder mask printing, and scratches on the board surface during handling.

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