Chip packaging device and chip packaging method

Abstract

The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging device, which comprises a base, a transmission device, a gluing device and a chip pushing device; the chip packaging device sequentially passes through the chip pushing device, the gluing device and a card on the upper side of the transmission device through the swing of a telescopic swing rod; the procedures of gluing, chip placing and press fitting are completed in sequence; the procedures of gluing, chip placement and press fitting can be completed at only one station; stations are reduced, and the cost is reduced; the conveying direction of the conveying device and the arrangement direction of the packaging device can be flexibly adjusted, the conveying direction of the conveying device can be perpendicular to the arrangement direction of the packaging device if the problem that the length of an assembly line is shortened is considered, the length of the whole assembly line can be shortened due to the fact that stations are reduced. And a high practical effect is achieved.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and in particular relates to a chip packaging device. Background technique [0002] In chip packaging, it is a common packaging method to package the chip on the card through glue. In this method, the packaging steps are divided into several processes such as slotting, gluing, chip placement, and press-fitting; among them, gluing, chip placement, and press-fitting require three different equipments to be carried out in sequence; there are many processes, The cost is high, the equipment layout space occupied is large, and the space cannot be flexibly arranged; therefore, it is necessary to design a process that only needs one station to complete gluing, chip placement and press-fitting; it can reduce the number of workers positions, reducing costs; at the same time, due to the reduction of positions, the space occupied by equipment on the assembly line is also reduced correspondingly, whic...

AI Technical Summary

Problems solved by technology

In this method, the packaging steps are divided into several processes such as slotting, gluing, chip placement, and press-fitting; among them, gluing, chip placement, and press-fitting require three different equipments to be carried out in sequence; there are many processes, The cost is high, the equipment layout space occupied is large, and the space cannot be flexibly arranged; therefore, it is necessary to design a process that only needs one station to complete gluing, chip placement and press-fitting; it can reduce the number of workers positions, reducing costs; at the same time, due to the reduction of positions, the space occupied by equipment on the assembly line is also correspondingly reduced, which has a high practical effect

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