Inductor component and inductor component mounting substrate
A technology for mounting substrates and inductors, which is applied to transformer/inductor parts, electrical components, printed circuits connected with non-printed electrical components, etc., which can solve problems that hinder the miniaturization of inductive components and reduce the degree of freedom in the design of inductive components.
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no. 1 Embodiment approach ＞
[0029] Hereinafter, a first embodiment of the inductor component will be described.
[0030] Such as figure 1 As shown, the inductor component 10 as a whole has a structure in which three thin plate-shaped layers are stacked in the thickness direction. In the following description, the stacking direction in which the three layers are stacked will be described as the up-down direction. In addition, the stacking direction is in figure 2 Middle is the direction perpendicular to the paper.
[0031] The first layer L1 is composed of four inductor wiring lines 20 , four dummy wiring lines 30 , and a first magnetic layer 41 . The first layer L1 is substantially square in plan view. The four inductance lines 20 are composed of a first inductance line 20A, a second inductance line 20B, and two third inductance lines 20C. In addition, the inductor wiring 20 is composed of a wiring main body 21 having a substantially constant line width, a first pad 22 connected to a first end of t...
no. 2 Embodiment approach ＞
[0064] Hereinafter, a second embodiment of the inductor component will be described. In addition, the second embodiment described below is mainly different from the inductor component 10 in the first embodiment in the shape and arrangement of the inductor wiring. In addition, the stacking direction is in Figure 4 The middle is the direction perpendicular to the paper.
[0065] Such as image 3 As shown, the inductor component 110 as a whole has a structure in which three thin plate-shaped layers are stacked in the thickness direction. In the following description, the stacking direction in which the three layers are stacked will be described as the up-down direction.
[0066] Such as Figure 4 As shown, the first layer L11 is composed of four inductor wirings 120 , one dummy wiring 130 , and a first magnetic layer 141 . The first layer L11 has a substantially rectangular shape in plan view. The four inductance lines 120 are composed of a first inductance line 120A, a se...
no. 3 Embodiment approach ＞
[0092] Hereinafter, a third embodiment of the inductor component will be described. In addition, the third embodiment described below is mainly different from the inductor component 10 in the first embodiment in the shape and arrangement of the inductor wiring. In particular, the layer where the inductance wiring is arranged differs.
[0093] Such as Figure 5 As shown, the inductance component 210 as a whole has a structure in which seven thin plate-shaped layers are stacked in the thickness direction. In the following description, the lamination direction in which each of the seven layers is stacked will be described as the up-down direction. In addition, the stacking direction is in Figure 6 The middle is the direction perpendicular to the paper.
[0094] The first layer L21 is composed of a first inductor wiring 220A, a dummy wiring 230A, a first layer connection wiring 261 , a first insulating portion 271 , and a first magnetic layer 241 . The first layer L21 has a ...
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