Composite preparation method of high-density coating

A coating and dense technology, applied in coating, metal material coating process, gaseous chemical plating, etc., can solve the problems of substrate material damage, unrealistic, low preparation rate, etc.

Inactive Publication Date: 2021-04-30
LANZHOU INST OF PHYSICS CHINESE ACADEMY OF SPACE TECH
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AI-Extracted Technical Summary

Problems solved by technology

However, due to the limitations of chemical vapor deposition technology, defects such as cracks and micropores will inevitably occur during the preparation of the coating.
When the coating is in use, these cracks and pores can form channels, causing the matrix material to be destroyed, thereby rendering the coating ineffective
Atomic layer deposition techn...
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Abstract

The invention discloses a composite preparation method of a high-density coating. The method adopts a manner of alternately preparing atomic layer deposition and chemical vapor deposition to finish the preparation of the high-density coating, and utilizes the high density of an atomic layer deposition coating to block defects such as cracks, micropores and the like in the chemical vapor deposition coating, heredity and development of various defects are prevented, so that the coating has the favorable barrier property, and meanwhile, the defect of low atomic layer deposition efficiency is overcome. The method can be used for preparing the coating with a high requirement on the compactness of the coating and larger thickness. The problem that a high-density coating prepared by purely adopting a chemical vapor deposition technology at present fails due to defects is solved.

Application Domain

Chemical vapor deposition coating

Technology Topic

CrazingHigh density +3

Image

  • Composite preparation method of high-density coating

Examples

  • Experimental program(3)

Example Embodiment

[0020]Example 1
[0021](1) Place the substrate in the reaction chamber, vacuum to 1 × 10-3PA;
[0022](2) Heat the substrate to 700 ° C and maintained;
[0023](3) Preparation of qi (IR) coating by atomic layer deposition technique, two precursors are acetylacetone (IR (Acac)3) And oxygen (O2), The coating thickness is 0.1 μm;
[0024](4) Preparation of 铱 (IR) coating by chemical vapor deposition technique, preparing source gas is acetylacetone (IR (Acac)3), The coating thickness is 2 μm;
[0025](5) Alternately repeat the above steps (3) and (4), wherein step (3) is repeated 51 times, and the step (4) repeats 50 times.

Example Embodiment

[0026]Example 2
[0027](1) Place the substrate in the reaction chamber, vacuum to 2 × 10-3PA;
[0028](2) Heat the substrate to 600 ° C and maintained;
[0029](3) Preparation of oxide (HFO) using atomic layer deposition techniques (HFO2) Coating, two precursors are tert-butyl alcohols (HF (T-Buo), respectively.4) And oxygen (O2), The coating thickness is 0.05 μm;
[0030](4) Preparation with chemical vapor deposition techniques (HFO2) The coating, the preparation source gas is tert-butyl alcohol, respectively (HF (T-Buo)4) And oxygen (O2), The coating thickness is 2 μm;
[0031](5) Alternately repeat the above steps (3) and (4), wherein step (3) is repeated 51 times, and the step (4) repeats 50 times.

Example Embodiment

[0032]Example 3
[0033](1) Place the substrate in the reaction chamber, vacuum to 4 × 10-3PA;
[0034](2) Heat the substrate to 700 ° C and maintained;
[0035](3) Preparation of qi (IR) coating by atomic layer deposition technique, two precursors are acetylacetone (IR (Acac)3) And hydrogen (H2), The coating thickness is 0.1 μm;
[0036](4) Preparation of 铱 (IR) coating by chemical vapor deposition technique, preparing source gas is acetylacetone (IR (Acac)3), The coating thickness is 2.5 μm;
[0037](5) Alternately repeat the above steps (3) and (4), wherein step (3) is repeated 41 times, step (4) repeated 40 times.
[0038]The present invention combines two techniques of atomic layer deposition and chemical vapor deposition, using two techniques to alternately prepare coatings, can utilize high-dense density of atomic layers, and achieve cracks, micro holes, etc. in chemical vapor deposition coating. The barrier of defects prevents the genetic and development of various defects, making the coating have good barrier performance, while overcoming the shortcomings of low deposition efficiency of atomic layers. This method can be used to prepare a coating having a high requirements and a large thickness of the coating thickness. Solve the problem of failure of highly defective coating due to the preparation of chemical vapor deposition techniques.

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