Efficient heat insulation board and preparation method thereof

A high-efficiency technology for thermal insulation, applied in thermal insulation, chemical instruments and methods, synthetic resin layered products, etc., can solve the problems of inability to ensure the uniformity of the insulation of the sandwich layer, the comprehensive performance of the composite board is reduced, and the bonding strength is not enough. Achieve the effect of improving comprehensive performance advantages, improving bonding strength and ensuring integrity

Active Publication Date: 2021-04-30
GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding strength between the skeleton support layers between the foams is not enough to easily cause cracking problems, and the uniformity of heat insulation of the sandwich layer cannot be guaranteed, resulting in gaps between the foams, which have no impact on the mechanical properties and light transmission properties. It will lead to the reduction of the comprehensive performance of the composite board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A high-efficiency thermal insulation board, including a first panel layer, a second panel layer, and a sandwich layer, wherein the sandwich layer is a foam layer, and the foam layer is formed by splicing several foam blocks; the sandwich layer is located in the second Between the first panel layer and the second panel layer, between the lower surface of the sandwich layer and the first panel layer, between the upper surface of the sandwich layer and the second panel layer, around the edges of the sandwich layer, and any two of the sandwich layers A functional structural layer is arranged in the seam adjacent to the foam block; the first panel layer and the second panel layer are both glass fiber reinforced unsaturated polyester composite materials; the foam block is a polyurethane foam block; the functional structure The layers consist of silica airgel and styrene-butadiene rubber microspheres; the thickness of the first panel layer is 1 mm, the thickness of the second p...

Embodiment 2

[0050] A high-efficiency thermal insulation board, the structure is different from Example 1 in that: the outer surface of the foam block is provided with a silica airgel felt skeleton support layer; the difference in the preparation method from Example 1 is: In step (1), each foam block is firstly wrapped with silica airgel felt, and then subsequent splicing is performed; the others are the same as in embodiment 1.

[0051] The density of the compartment board prepared in this embodiment is 0.22g / cm 3 , The compressive strength is 3.6Mpa.

Embodiment 3

[0053] A high-efficiency thermal insulation board, the structure is different from Example 1 in that: the outer surface of the foam block is provided with a glass fiber reinforced unsaturated polyester skeleton support layer; the difference in the preparation method from Example 1 is: In step (1), each foam block is firstly wrapped with a glass fiber reinforced unsaturated polyester prepreg tape, and then subsequent splicing is performed; the others are the same as in Embodiment 1.

[0054] The density of the compartment board prepared in this embodiment is 0.25 g / cm 3 , the compressive strength is 4.0 Mpa.

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Abstract

The invention belongs to the technical field of preparation of composite boards, and discloses an efficient heat insulation board and a preparation method thereof. The efficient heat insulation board comprises a first panel layer, a second panel layer and a sandwich layer, wherein the sandwich layer is formed by stacking one or more foam layers, and each foam layer is formed by splicing a plurality of foam blocks; the sandwich layer is located between the first panel layer and the second panel layer, and functional structure layers are arranged between the lower surface of the sandwich layer and the first panel layer, between the upper surface of the sandwich layer and the second panel layer, on the peripheral edge of the sandwich layer and in splicing seams of any two adjacent foam blocks in the sandwich layer; the first panel layer and the second panel layer are both made of a fiber reinforced resin composite material; the foam blocks are polyurethane foam blocks, PVC foam blocks or phenolic foam blocks; and the functional structure layers are composed of aerogel and functional filler. The efficient heat insulation board is provided with the functional structure layers with heat insulation, buffering and mechanical properties, and the overall comprehensive performance advantage of the composite board is further improved.

Description

technical field [0001] The invention belongs to the technical field of composite board preparation, and in particular relates to a high-efficiency heat insulation board and a preparation method thereof. Background technique [0002] The performance of light weight and thermal insulation has always been an important functional attribute in the application of panels, and it is also a hot research direction in the field of panels. Especially in the field of building materials, panels with light weight and excellent thermal insulation performance are very popular. This is because this panel has a low density, which greatly reduces the load-bearing burden of the building skeleton, and reduces the difficulty of construction, and the thermal insulation performance can also meet the application requirements. . [0003] At present, this kind of lightweight thermal insulation composite board is mostly composed of heat-insulating sandwich layers and panels, and the panels are mostly m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/80B32B27/36B32B27/32B32B27/08B32B27/20B32B27/40B32B33/00B32B3/22
CPCE04B1/80B32B27/36B32B27/322B32B27/08B32B27/20B32B27/065B32B33/00B32B5/18B32B3/18B32B2262/101B32B2266/0278B32B2307/304B32B2307/56Y02B80/10Y02A30/24
Inventor 潘广镇方璐董会娜刘光亚周蕾姚栋嘉刘喜宗吴恒张东生
Owner GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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