Efficient heat insulation board and preparation method thereof
A high-efficiency technology for thermal insulation, applied in thermal insulation, chemical instruments and methods, synthetic resin layered products, etc., can solve the problems of inability to ensure the uniformity of the insulation of the sandwich layer, the comprehensive performance of the composite board is reduced, and the bonding strength is not enough. Achieve the effect of improving comprehensive performance advantages, improving bonding strength and ensuring integrity
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Embodiment 1
[0039] A high-efficiency thermal insulation board, including a first panel layer, a second panel layer, and a sandwich layer, wherein the sandwich layer is a foam layer, and the foam layer is formed by splicing several foam blocks; the sandwich layer is located in the second Between the first panel layer and the second panel layer, between the lower surface of the sandwich layer and the first panel layer, between the upper surface of the sandwich layer and the second panel layer, around the edges of the sandwich layer, and any two of the sandwich layers A functional structural layer is arranged in the seam adjacent to the foam block; the first panel layer and the second panel layer are both glass fiber reinforced unsaturated polyester composite materials; the foam block is a polyurethane foam block; the functional structure The layers consist of silica airgel and styrene-butadiene rubber microspheres; the thickness of the first panel layer is 1 mm, the thickness of the second p...
Embodiment 2
[0050] A high-efficiency thermal insulation board, the structure is different from Example 1 in that: the outer surface of the foam block is provided with a silica airgel felt skeleton support layer; the difference in the preparation method from Example 1 is: In step (1), each foam block is firstly wrapped with silica airgel felt, and then subsequent splicing is performed; the others are the same as in embodiment 1.
[0051] The density of the compartment board prepared in this embodiment is 0.22g / cm 3 , The compressive strength is 3.6Mpa.
Embodiment 3
[0053] A high-efficiency thermal insulation board, the structure is different from Example 1 in that: the outer surface of the foam block is provided with a glass fiber reinforced unsaturated polyester skeleton support layer; the difference in the preparation method from Example 1 is: In step (1), each foam block is firstly wrapped with a glass fiber reinforced unsaturated polyester prepreg tape, and then subsequent splicing is performed; the others are the same as in Embodiment 1.
[0054] The density of the compartment board prepared in this embodiment is 0.25 g / cm 3 , the compressive strength is 4.0 Mpa.
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