Data monitoring method applied to AOI detection

Abstract

The invention belongs to the technical field of AOI technology application, and particularly relates to a data monitoring method applied to AOI detection. A monitoring machine used in the method comprises a workbench, a conveying rotary ring and a fixing block. The upper surface of the workbench is rotationally connected with a conveying rotary ring. The inner arc surface of the conveying rotary ring is fixedly connected with a gear ring; a gear is rotatably connected to the interior of the workbench; the lower surface of the gear is fixedly connected with a first motor; fixing blocks which are uniformly arranged are arranged on the upper surface of the conveying rotary ring; and a PCB is arranged above the fixing block. AOI detection of the PCB is effectively realized, the detected PCB is randomly monitored, the inaccurate detection data is avoided, the problem of batch detection can be effectively avoided when the first AOI detector has equipment problems, and the problem detection accuracy of bad PCBs is improved through secondary detection of unqualified PCBs.

Description

technical field [0001] The invention belongs to the technical field of AOI technology application, in particular to a data monitoring method applied to AOI detection. Background technique [0002] The full name of AOI in Chinese is Automatic Optical Inspection, which is a device based on optical principles to detect common defects encountered in welding production. AOI is a new type of testing technology that has emerged, but it has developed rapidly. Many manufacturers have introduced AOI testing. Equipment, when automatic detection, the machine automatically scans the PCB through the camera, collects images, compares the tested solder joints with the qualified parameters in the database, and after image processing, checks out the defects on the PCB, and displays the defects through the display or automatic signs / Marked out for repair by maintenance personnel. [0003] According to CN111598491B, a data monitoring method and electronic equipment applied to AOI detection, ...

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Problems solved by technology

[0006] In order to make up for the prior art, due to factors such as fixed installation, environmental conditions, and substrate deformation of the PCB board, the accuracy of the detection will decrease when the PCB board is inspected. At the same time, the equipment itself works for a long time. After a problem occurs, If it cannot be detected in time, it is easy to have batch detection problems. For this reason, it is necessary to monitor the data information of the detection. At the same time, for the detected defective products, in order to avoid false detection, a secondary detection can be carried out. If there are solder foreign objects on the lower surface or the PCB board itself has a large warpage and deformation, it will have a great impact on product inspection, and even lead to problems such as product defects that cannot be effectively detected. The data proposed by this invention is applied to AOI inspection. monitoring method

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