Image sensor module and intelligent environment monitoring system
A technology for image sensors and substrates, applied in instruments, measuring devices, semiconductor devices, etc., can solve problems such as image sensor damage, poor heat dissipation, etc., and achieve the effect of facilitating heat dissipation
Active Publication Date: 2021-06-18
广东际洲科技股份有限公司
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Problems solved by technology
However, as the image sensor is used for a long time to detect the environment, the image sensor will generate a lot of heat, and poor heat dissipation for a long time will cause irreversible damage to the image sensor
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[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0044] It should be noted that like numerals and let...
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The invention provides an image sensor module and an intelligent environment monitoring system with the image sensor module. The image sensor module includes a substrate, the upper surface of the substrate has a first groove, and the lower surface of the substrate has stepped first grooves with different widths. Two grooves, the deepest bottom of the step-shaped second groove communicates with the bottom of the first groove; the flat heat pipe structure is located in the step-shaped second groove; the image sensor chip is directly connected to the flat plate through thermal conductive glue The heat pipe structure is in contact with the metal layer on the side close to the upper surface of the substrate; the protruding structure is higher than the upper surface of the substrate and is sealed with the side wall of the flat heat pipe structure; the bracket is fixed on the base of the substrate by sealing solder. On the surface, the bracket has a transparent member corresponding to the vertical projection direction of the image sensor chip; the optical system is arranged above the transparent member. The image sensor has good heat dissipation performance and can monitor the environment for a long time.
Description
technical field [0001] The present invention provides an image sensor module and an intelligent environment monitoring system with the image sensor module. The image sensor module has good heat dissipation performance and can be detected by the intelligent environment monitoring system with the image sensor module for a long time. The image sensor module will not be damaged by the thermal effect caused by long-time work, and the stability of the environment monitoring system can be improved. Background technique [0002] Environmental monitoring is to track the changes in environmental quality and determine the level of environmental quality through the detection of the content and emission of various substances that have an impact on humans and the environment, providing the basis and guarantee for environmental management and pollution control. Understanding the environmental level and conducting environmental monitoring are the prerequisites for carrying out all environme...
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IPC IPC(8): H01L27/146G01D21/02
CPCG01D21/02H01L27/14601H01L27/14618H01L27/14683
Inventor 陈淑清
Owner 广东际洲科技股份有限公司