Curable composition

A curable composition and compound technology, applied in the direction of non-polymer organic compound adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve problems such as curing deformation, viscosity reduction, and inability to use

Pending Publication Date: 2021-05-04
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, UV-curable adhesives can be cured quickly, but there are disadvantages such as curing deformation caused by curing shrinkage on the other side, low adhesive strength, and inability to bond parts that are not exposed to light.
On the other hand, although thermosetting epoxy resin adhesives are low-temperature-short-time curable adhesives, there are problems such as the following: During bonding, the parts to be bonded must be moved to maintain the bonded posture. Fixing with jigs or devices, and lowering viscosity due to temperature rise due to heating, causing sagging (タレ) just before curing, or flowing to places other than the desired location, etc., are not necessarily satisfactory.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0196] Hereinafter, the present invention will be more specifically described based on examples and comparative examples, but the present invention is not limited to the following examples.

[0197] 1. Raw materials

[0198]

[0199] (1A) IRR-214K: manufactured by DAICEL-ALLNEX, tricyclodecane dimethanol diacrylate, molecular weight: 300, number of acryloyl groups per molecule: 2

[0200] (1B) EBECRYL150: manufactured by DAICEL-ALLNEX, EO-modified bisphenol A diacrylate, molecular weight: 512, number of acryloyl groups per molecule: 2

[0201] (1C) DPHA: manufactured by DAICEL-ALLNEX, dipentaerythritol hexaacrylate, molecular weight: 524, number of acryloyl groups per molecule: 6

[0202] (1D) EBECRYL168: manufactured by DAICEL-ALLNEX, phosphoric acid-modified methacrylate, molecular weight: 270, number of methacryloyl groups in 1 molecule: 1.5.

[0203]

[0204] (2A) jER1001: manufactured by Mitsubishi Chemical Corporation, bisphenol A epoxy resin, epoxy equivalent (EP...

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PUM

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Abstract

The invention provides a curable composition having both excellent photo-curability and excellent thermosetting properties. The curable composition comprises: (1) a compound that has a (meth)acryloyl group, (2) an epoxy compound that has two or more epoxy groups in one molecule and is solid at 25 DEG C, (3) a polythiol compound that has two or more mercapto groups in one molecule, (4) a photo-radical generator, and (5) a latent curing agent, wherein the amount of the component (3) is from 15% by weight to 50% by weight with respect to the entire curable composition.

Description

technical field [0001] The present invention relates to curable compositions. Background technique [0002] In recent years, along with the reduction in thickness of portable devices such as smartphones, camera modules mounted on portable devices such as smartphones have been reduced in size. Also, it is expected that a camera module will be installed in wearable devices, and there is an increasing demand for miniaturization and thinning. In addition, as the size of the camera module decreases, the parts for bonding and fixing the components of the camera module become finer. Therefore, the impact resistance of the camera module when it is dropped becomes very important. Therefore, even if the camera module is subjected to an impact caused by a drop, the adhesion must be maintained even if the bonding area between the constituent parts is small. The improvement of the adhesive strength per unit area of ​​the adhesive. [0003] On the other hand, in order to avoid thermal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/02C09J11/06H04N5/225
CPCC09J4/06C09J11/06H04N23/50
Inventor 田村贤佐藤大河新田亚季
Owner AJINOMOTO CO INC
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