Electrocoppering thickness measuring method and circuit board
A technology for circuit boards and electroplating copper, which is used in measurement devices, instruments, etc., to solve the problems of copper thickness monitoring, inability to meet the production requirements of thin lines, and inability to directly measure lines.
Inactive Publication Date: 2021-05-04
悦虎晶芯电路(苏州)股份有限公司
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Problems solved by technology
The traditional board surface plating process can no longer meet the production requirements of thin lines. More and more circuit board manufacturers have begun to introduce the MSAP (modified Semi-Additive process) process. In the production process using this process, the conductor copper thickness (line and large copper surface) is the focus of control
[0003] Due to the uneven distribution of the lines, the electroplating area is uneven. After the electroplating process is completed, the copper thickness on the circuit board cannot be monitored in a quick and effective way. The traditional CMI (copper thickness measuring instrument) cannot measure the lines. Direct, can only be measured and monitored by destructive sectioning
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[0026] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. Note that the aspects described below in conjunction with the drawings and specific embodiments are only exemplary, and should not be construed as limiting the protection scope of the present invention.
[0027] Such as figure 1 As shown, the embodiment of the present invention provides a method for measuring the thickness of electroplated copper, comprising the following steps:
[0028] S1. Take several circuit boards in advance, and use a copper thickness measuring instrument to detect the copper thickness T of the copper skin on each circuit board. 1 ......T n , and then slice at each copper skin to measure the actual copper thickness T 1 '...T n ’, to get the average value of copper thickness difference
[0029] S2. During mass production, use a copper thickness measuring instrument to detect the copper thickness T′ at the copper ski...
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The invention provides an electrocoppering thickness measuring method and a circuit board, and the method comprises the following steps of: S1, taking a plurality of circuit boards in advance, detecting the copper thickness of a copper sheet on each circuit board, and measuring the actual copper thickness of a slice at each copper sheet to obtain a copper thickness difference mean value; and S2, during batch production, detecting the copper thickness at the copper sheet of each circuit board, and adding the copper thickness difference mean value to obtain the actual copper thickness. According to the method, the copper sheet is designed on the circuit board, and the copper thickness difference value is measured in advance, so that the copper thickness can be simply and quickly measured and monitored during batch production of the circuit board, a large amount of slice measurement time is saved, and scrap caused by destructive slices can be avoided.
Description
technical field [0001] The invention relates to circuit board processing technology, in particular to a method for measuring the thickness of electroplated copper and a circuit board. Background technique [0002] With the continuous innovation and development of electronic products in the direction of multi-functionality and intelligence, higher requirements are put forward for the carrier printed circuit board carrying electronic parts, and the circuit board is also promoted to be light, thin, short and small. Development, so the designed lines are getting denser and thinner. The traditional board surface plating process can no longer meet the production requirements of thin lines. More and more circuit board manufacturers have begun to introduce the MSAP (modified Semi-Additive process) process. In the production process using this process, the conductor copper thickness (line and large copper surface) is the focus of control. [0003] Due to the uneven distribution of ...
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IPC IPC(8): G01B21/08
CPCG01B21/08
Inventor 黄治国
Owner 悦虎晶芯电路(苏州)股份有限公司