Mainboard heat dissipation device for new-generation information technology computer

Abstract

The invention relates to the technical field of electromechanical equipment, and discloses a mainboard heat dissipation device for a new-generation information technology computer. The mainboard heat dissipation device comprises an equipment main body, a mainboard is arranged in the equipment main body, a temperature relay is arranged on a board body of the mainboard, the inner walls of the left and right sides of the equipment main body are fixedly connected with mounting brackets, a direct current motor is arranged in the middle of the mounting brackets, and a cooling fan is arranged at the output end of the direct current motor. According to the mainboard heat dissipation device for the new-generation information technology computer, when the temperature of the mainboard rises, a temperature relay is heated to work to enable a circuit to be closed, an external driving device drives a piston to reciprocate, the piston repeatedly sucks air into a compression air cylinder and compresses the air, when the pressure intensity is large enough, a second valve is opened, compressed air enters the vortex chamber to rapidly expand and accelerate and generate vortex to separate cold air flow and hot air flow, and the cold air flow flows to the mainboard through the cold air pipe, so that the mainboard is rapidly cooled.

Description

technical field [0001] The invention relates to the technical field of electromechanical equipment, in particular to a new-generation information technology computer motherboard cooling device. Background technique [0002] Electromechanical equipment can be divided into three categories according to their uses, namely, industrial electromechanical equipment, information electromechanical equipment and livelihood electromechanical equipment, among which information electromechanical equipment includes computers, printers and communication equipment. The computer motherboard is generally a rectangular circuit board, on which are installed the main circuit system and the CPU that make up the computer. The CPU will generate a certain amount of heat when it is working. Therefore, the main computer box of the computer is generally equipped with a cooling device to dissipate heat from the motherboard to ensure system stability. run. However, the existing mainboard heat dissipatio...

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Problems solved by technology

However, the existing mainboard heat dissipation devices all use cooling fans to cooperate with cooling holes to dissipate heat, and it is not easy to adjust the fan speed according to the temperature in the main chassis, and the CPU will generate a large amount of heat when it is working under a high load. At this time, the cooling fan is not enough to quickly The heat is discharged from the main chassis, so the motherboard cannot be cooled in time, which will shorten the service life of the motherboard over time and affect the working stability of the computer

[0003] Aiming at the deficiencies of the prior art, the present invention provides a new generation of information technology computer motherboard cooling device, which has the advantages of automatically adjusting the cooling fan speed, rapidly cooling the motherboard, and high heat dissipation and cooling efficiency. The heat dissipation effect of the motherboard cooling device is not ideal

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