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Display screen packaging support and packaging method

A technology for encapsulating brackets and display screens, which is used in the identification of devices, instruments, electrical components, etc., can solve the problems of poor yield and the display screen cannot be freely arranged in shape, etc. Effect

Pending Publication Date: 2021-05-07
CHUZHOU HKC OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to propose a display screen packaging bracket, aiming to solve the technical problems of poor yield rate caused by the structural defects of the display screen packaging bracket, and the packaged display screen cannot be freely arranged in shape

Method used

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  • Display screen packaging support and packaging method
  • Display screen packaging support and packaging method
  • Display screen packaging support and packaging method

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the relationship between the components in a certain posture. If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, if there are descriptions involving "first", "second" and so on in the...

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Abstract

The invention discloses a display screen packaging support and a packaging method. The support comprises a packaging groove, a sunken part, a protruding part and a connecting electrode, wherein the packaging groove is formed in the top surface of the support; the sunken part is formed by inwards sinking the left end surface of the support; the protruding part is formed by outwards protruding the right end surface of the support; and one end of the connecting electrode is fixed on the end surface of the support, the other end of the connecting electrode is fixed in the packaging groove through the interior of the support, and the technical problems that the yield is poor, and a packaged display screen cannot be freely arranged in shape due to the structural defect of a display screen packaging support in the prior art are solved. The technical effects of being simple in structure, easy to assemble, high in density, accurate in arrangement size, capable of improving the yield of the display screen and capable of being freely arranged are achieved.

Description

technical field [0001] The invention relates to the technical field of display screen manufacturing, in particular to a display screen package bracket and a package method. Background technique [0002] Traditional Mini LED (Mini Light Emitting Diode, tiny light-emitting diode) generally uses cob (chip On board, chip on board package) package, which is to directly package the bare chip on the substrate. Although it can achieve the purpose of compact and fast assembly, However, the chip has not been screened by photoelectric testing, and it is prone to abnormalities during packaging, which makes the yield rate of this packaging method poor. Another way is to package by patch, that is, first package the chip on the bracket to form a single small-sized lamp bead, and then paste the lamp bead on the substrate. This method is because the chip is packaged first. Normal photoelectric testing can be carried out in advance, and the packaging yield rate is greatly improved. However,...

Claims

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Application Information

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IPC IPC(8): H01L25/075G09F9/33H01L33/48H01L33/54H01L33/62
CPCH01L25/0753H01L33/483H01L33/62H01L33/54G09F9/33
Inventor 张梅余思慧
Owner CHUZHOU HKC OPTOELECTRONICS TECH CO LTD
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