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OTP device structure, manufacturing method thereof and OTP memory

A technology of device structure and manufacturing method, which is applied in the field of memory, can solve the problems of difficult storage unit size and shrinkage, and achieve the effects of improving breakdown resistance, reducing size, and reducing channel length

Active Publication Date: 2021-05-07
ZHUHAI CHUANGFEIXIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides an OTP device structure and its manufacturing method, and OTP memory, to solve the problem that the size of the storage unit of the OTP embedded memory in the prior art is difficult to continue to shrink with the progress of the process platform

Method used

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  • OTP device structure, manufacturing method thereof and OTP memory
  • OTP device structure, manufacturing method thereof and OTP memory
  • OTP device structure, manufacturing method thereof and OTP memory

Examples

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Embodiment Construction

[0037] As mentioned in the background art section, it is difficult for the traditional two-transistor one-time programmable embedded memory cell (2TOTP cell) to shrink continuously with the progress of the technology platform.

[0038] The main reason that the inventor finds that the above-mentioned problem occurs is:

[0039] See figure 1 , figure 1 It is a structural schematic diagram of a double-tube shared word line one-time programmable embedded memory unit in the prior art; the double-tube shared word line OTP embedded memory unit includes a P well, a plurality of N+ regions located on one surface of the P well, like figure 1 As shown in , the left N+ region and the middle N+ region and the gate above the P well between the two N+ regions form a gate; the length between the left N+ region and the middle N+ region is the selection The channel length of the through pipe; the middle N+ region, the N+ region on the right and the gate above the P well between the two N+ re...

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Abstract

The invention provides an OTP device structure, a manufacturing method thereof and an OTP memory. According to the OTP device structure, the substrate and channel injection condition of at least one of a source region and a drain region of a gate tube is modified to be the same as the substrate and channel injection condition of a low-voltage device, so that the anti-breakdown capability between the source and the drain is improved, the channel length of the gate tube can be further reduced compared with the prior art, that is, the channel length is further reduced by changing the substrate and channel injection condition of the gate tube, the size of the OTP memory unit is further reduced, and that is, the size of the OTP memory can be further reduced.

Description

technical field [0001] The invention relates to the technical field of memory, in particular to an OTPOTP device structure, a manufacturing method thereof, and an OTP memory. Background technique [0002] The programming and reading methods of the one-time programmable (OTP, One Time Programmable) embedded memory will have a great impact on the performance of the one-time programmable embedded memory, and different setting methods will affect the performance of the one-time programmable embedded memory. Size, yield and reliability have different effects. [0003] System-on-Chip (SOC) designs have a huge demand for one-time programmable embedded memories. With the continuous improvement of the technology platform, the size of the traditional dual-transistor shared word line one-time programmable embedded memory cell (2T OTP cell) should continue to shrink with the advancement of the technology platform. [0004] However, in practice, the size of OTP embedded memory cells is...

Claims

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Application Information

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IPC IPC(8): H01L27/112
CPCH10B20/20Y02P70/50
Inventor 王志刚贾宬李弦
Owner ZHUHAI CHUANGFEIXIN TECH CO LTD