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High-processing-capability gold immersion process based on selective application of jet printing ink

An ink and capability technology, applied in the field of high process capability chemical gold process, can solve the problems of screen production cost, high cost, uncertain expansion and shrinkage of PCB board, save time cost and economic cost, improve process capability, Printing with high precision

Inactive Publication Date: 2021-05-07
PLOTECH TECH KUNSHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) Every time a product is printed, it is necessary to make a screen printing screen, and the loss must also be considered. The cost of making the screen needs to be paid, and the efficiency is very slow. The larger the product, the higher the cost;
[0004] (2) Screen printing needs to be printed on one side, and it takes a long time to print the other side after each printing has to be dried;
[0005] (3) After the PCB board is baked, it will produce uncertain expansion and contraction, which will cause great difficulties in the quality control of processing.

Method used

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Examples

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Comparison scheme
Effect test

Embodiment

[0020] A kind of selective use of jet printing ink of the present invention is a high-process-ability gold-forming process, and its steps include:

[0021] ① Shoot the target area of ​​the PCB board;

[0022] ②According to the actual target position photographed, after the program processing of the jet printing machine, determine the protection range of chemical gold;

[0023] ③Refer to the protection range of chemical gold, use a jet printer to spray UV-curable selective ink on the PCB under the irradiation of UV light, and the viscosity of the selective ink is 5-20mPa·s;

[0024] ④Chemical gold processing of PCB board;

[0025] ⑤Peel off the selected ink from the PCB board.

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Abstract

The invention belongs to the technical field of printed circuit board manufacturing, and relates to a high-process-capability gold immersion process based on the selective application of jet printing ink. The process comprises the following steps of: (1) shooting a target area of a PCB; (2) according to the shot actual target position, determining a gold immersion protection range through jet printing machine program processing; (3) in reference to the gold immersion protection range, spraying ultraviolet-curable selective printing ink to a PCB through a jet printing machine under the irradiation of a UV lamp, and the viscosity of the selective printing ink being 5-20 mPa.s; (4) carrying out chemical metal processing on the PCB; and (5) stripping the selective printing ink from the PCB. According to the process of the invention, the time cost and the economic cost for manufacturing a silk-screen printing plate are saved, the jet printing precision is higher, the speed is higher, and the processing capability of the circuit board is comprehensively improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a high-process-capacity gold plating process using jet printing ink. Background technique [0002] At present, the surface treatment of high-end HDI produced by PCB board factories is OSP+chemical gold process, which are all traditional screen printing / dry film attachment modes, and the OSP area is printed with thermosetting anti-chemical gold ink / dry film for printing protection. The specific steps are generally: making a screen printing screen, printing the first side, four-stage baking, printing the second side, gold, and ink stripping. There are many problems with this approach: [0003] (1) Every time a product is printed, it is necessary to make a screen printing screen, and the loss must also be considered. The cost of making the screen needs to be paid, and the efficiency is very slow. The larger the product, the higher the cost; [0004] (2)...

Claims

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Application Information

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IPC IPC(8): H05K3/24H05K3/00
CPCH05K3/0079H05K3/24
Inventor 李齐良
Owner PLOTECH TECH KUNSHAN CO LTD
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