High-power laser Bar packaging vacuum reflow furnace positioning clamp device

A vacuum reflow and positioning fixture technology, which is applied in auxiliary devices, manufacturing tools, metal processing equipment, etc., can solve the problems of low position accuracy and inability to quickly respond to workpiece position changes

Pending Publication Date: 2021-05-11
烟台华创智能装备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method cannot quickly respond to the position chang

Method used

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  • High-power laser Bar packaging vacuum reflow furnace positioning clamp device
  • High-power laser Bar packaging vacuum reflow furnace positioning clamp device
  • High-power laser Bar packaging vacuum reflow furnace positioning clamp device

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Embodiment Construction

[0030] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the presently disclosed embodiments as recited in the appended claims.

[0031] see Figure 1-4 , in an embodiment of the present invention, a high-power laser Bar packaging vacuum reflow furnace positioning fixture device, including: a base 1, the top of the base 1 has a right-angle clamping part for clamping and etching a silicon wafer; The etching silicon wafer positioning groove module 2 of the clamping part, the etching silicon wafer posi...

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Abstract

The invention relates to the technical field of ultra-precision electronic product processing, in particular to a high-power laser Bar packaging vacuum reflow furnace positioning clamp device which comprises a base, an etched silicon wafer positioning groove module and an adjusting and assembling module. The top of the base is provided with a right-angle clamping part for clamping an etched silicon wafer. The etched silicon wafer positioning groove module is installed on the right-angle clamping part and is used for clamping a chip set to be welded and enabling the chip set to be welded to abut against the etched silicon wafer. The adjusting and assembling module is used for positioning the etched silicon wafer positioning groove module. The high-power laser Bar packaging vacuum reflow furnace positioning clamp device has the beneficial effects that a workpiece is divided into a plurality of parts to be clamped on the base and the etched silicon wafer positioning groove module, and then all the parts are positioned through the adjusting and assembling module; the high position freedom degree of a probe clamp is ensured, the position change of the workpiece can be quickly coped with, and the workpiece can be accurately clamped; and relative independence of welding of the parts is ensured, movement of the previous part caused by placement of the next part is avoided, and packaging quality of finished products is improved.

Description

technical field [0001] The invention relates to the technical field of ultra-precision electronic product processing, in particular to a high-power laser Bar packaging vacuum reflow furnace positioning fixture device. Background technique [0002] High-power laser Bar packaging has strict technical requirements. Because the product is very small, some areas cannot be touched, and the assembly process must be carried out under a microscope. The positioning accuracy of the chip and the heat sink for direct welding are required to be within a few microns, and the packaging The process requires not only a vacuum environment, but also a certain pressure on the workpiece to ensure good coplanarity. [0003] In addition, during the laser vacuum welding process, multiple components need to be assembled and positioned step by step to complete the vacuum reflow soldering, which further requires that each component must have precise positioning, and at the same time ensure that the wel...

Claims

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Application Information

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IPC IPC(8): B23K3/08B23K1/008
CPCB23K1/008B23K3/087
Inventor 金卫刚邹军许永可苏晓锋王国兴申帮兴张新峰张媛媛
Owner 烟台华创智能装备有限公司
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