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Display device and manufacturing method thereof

A technology for display devices and encapsulation layers, which is applied in the directions of identification devices, final product manufacturing, and sustainable manufacturing/processing. rate, improve the effect of impact resistance

Active Publication Date: 2022-05-31
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the hardness and strength of the flexible cover will be difficult to guarantee the impact resistance of the flexible display device. During the pen-drop test and / or the drop-ball test, the flexible cover cannot effectively absorb the shock wave, and the shock wave will continue to pass downward, resulting in display failure or failure. Package failure and other issues

Method used

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  • Display device and manufacturing method thereof
  • Display device and manufacturing method thereof
  • Display device and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0048] Please refer to FIG. 1. FIG. 1 is a schematic diagram of a first structure of a display device provided by an embodiment of the present application. Implementation of this application

[0049] Wherein, the encapsulation layer 20 is provided on the substrate 10. The flexible cover plate 30 is disposed on the side of the encapsulation layer 20 away from the substrate 10 .

[0050] It can be seen that the embodiment of the present application provides a display device 100. In the display device 100, by encapsulating

[0051] In the embodiment of the present application, the substrate 10 is a flexible substrate. The flexible substrate can be polyimide substrate, polyethylene terephthalate

[0052] In the embodiment of the present application, the number of the buffer airbags 40 may be one or more. of the plurality of buffer airbags 40

[0053] In the embodiment of the present application, the side of the substrate 10 close to the encapsulation layer 20 is provided with the ...

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Abstract

The present application discloses a display device and a manufacturing method thereof. The display device includes a substrate, an encapsulation layer, a flexible cover plate and a buffer airbag. The encapsulation layer is disposed on the substrate, the flexible cover is disposed on a side of the encapsulation layer away from the substrate, the buffer airbag is disposed in the encapsulation layer or the flexible cover, or the The buffer airbag is disposed between the encapsulation layer and the flexible cover. The application can improve the impact resistance of the display device, ensure that the display device can pass the ball drop test smoothly, and further improve the product yield.

Description

Display device and method of making the same technical field [0001] The present application relates to the field of display technology, in particular to a display device and a manufacturing method thereof. Background technique [0002] Flexible display devices have become a promising new display device in recent years due to their thinness and flexibility. devices, and are widely used in various high-performance display fields. Before the flexible display device is put into the market, it is generally aimed at Its impact resistance and surface properties are used to perform performance evaluations. For example, resistance can be performed by a pen-drop test and / or a ball-drop test Impact assessment. In the existing flexible display device, in order to meet the bending characteristics, a flexible cover plate is usually used to replace the traditional glass. Glass cover, and the thickness of flexible cover is usually below 100 microns. Therefore, the hardness and st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L23/00H01L21/84G09F9/30
CPCH01L27/1218H01L27/1262H01L23/562G09F9/301Y02P70/50
Inventor 蔡振飞
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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