Device and method for controlling forming thickness of glass substrate by overflow method
A glass substrate, thickness control technology, applied in glass forming, glass forming, glass manufacturing equipment, etc., can solve problems such as uneven thickness
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[0048] Implementation mode three: if Figure 7 As shown, when the thickness of the first low point 311 and the second low point 313 of the thickness curve are below the center line, and the thickness of the middle high point 312 is above the center line, if it is adjusted by adjusting the cooling air volume, it needs Increase the air volume of the cooling air duct corresponding to the first low point 311 and the second low point 313, and reduce the air volume at the point corresponding to the high point 312, so the adjustment often fails to achieve the desired effect. In the present invention, the corresponding first U-shaped cooling air duct 611 and the second U-shaped cooling air duct 613 are moved to reduce the distance S2 between the heat-absorbing inclined surfaces of the soaking box to enhance the cooling effect, and at the same time move the high-point U-shaped cooling air duct 612. Increase the distance S2 between the heat-absorbing slopes of the soaking box and reduce...
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