Plastic packaging press

Abstract

The invention relates to the technical field of semiconductor packaging equipment, and provides a plastic packaging press. The press aims to solve the problem that a large number of bubbles exist in a liquid plastic packaging material after the plastic packaging material is molten due to the fact that a solid plastic packaging material cannot fill a mold hole and a large amount of air exists in a mold in an existing plastic packaging press, and comprises a supporting lower mold, an upper mold and an injection head. The upper mold can be pressed on the supporting lower mold, the upper surface of the supporting lower mold is provided with a first containing hole and a first runner communicated with the first containing hole, the lower surface of the upper mold is correspondingly provided with a second containing hole and a second runner communicated with the second containing hole, the upper mold is further provided with a feeding channel communicated with the second runner, and the injection head is connected with a driving rod. The injection head is matched with the feeding channel and slides along the feeding channel; and the injection head comprises a shell, a sliding way is formed in the shell, an injection rod with a T-shaped longitudinal section is slidably connected into the sliding way, a first through hole communicated with the sliding way is formed at the upper end of the shell, and a second through hole communicated with the sliding way is formed in the bottom face of the shell.

Description

Technical field[0001]The present invention relates to the technical field of packaging equipment of semiconductors, in particular a plastic sealing machine.Background technique[0002]The semiconductor package refers to the process of obtaining an independent chip by the wafer that will be tested according to the product model and functional requirements. The package process is: the wafer from the wafer front process is cut into small wafers by the scribing process, and then cut the cut wafer is attached to the small island of the corresponding substrate frame, and use ultrafine Metal wire or conductive resin connects the engagement pad of the wafer to the respective pin of the substrate, and constitutes the required circuit; then the independent wafer is applied to the plastic housing to protect, and a series of operations, packages after the plastic seal After completing, the finished product test is performed, usually the process of inspection, testing and packaging, and finally sh...

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to provide a plastic sealing press to solve the problem that in the existing plastic sealing press, there is a large amount of air in the mold hole due to the fact that the solid plastic sealing compound cannot fill the mold hole. There will be a lot of bubbles

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