Circuit board and driving power supply with the same

Abstract

The invention discloses a circuit board, which comprises a main board and at least one metal-based copper-clad plate, the base material of the main board is made of an insulating material, and each metal-based copper-clad plate is provided with at least one component and a pin connected with the main board. The invention also discloses a driving power supply with the circuit board. According to the circuit board and the driving power supply with the circuit board, the structure is simple, the manufacturing cost is low, automatic manufacturing is facilitated, a power device can be directly mounted on the metal substrate through automatic equipment, the metal substrate achieves the function of a radiator, the production efficiency is improved, and potential quality hazards are reduced; and meanwhile, the grounding problem of the metal substrate is solved, and the EMC problem is avoided.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of a driving power supply, in particular to a circuit board and a driving power supply with the circuit board. Background technique [0002] Now the use of electronic products is more and more extensive, and the use of electronic products is inseparable from power supply, and to provide power to electronic products, it is necessary to use a driving power supply (switching power supply) to connect electronic products to the mains. The driving power supply includes a casing and a PCB installed in the casing. The lower surface of the PCB is generally close to the inner wall of the casing, and the heat dissipation effect is poor. [0003] In order to solve the above problems, for power devices that generate more heat during operation, the traditional method is to install a heat sink on the heat generating power device, and the heat sink and the power device are fastened together by screws or ...

AI Technical Summary

Problems solved by technology

The driving power supply includes the casing and the PCB board installed in the casing. The lower end surface of the PCB board is generally close to the inner wall of the casing, and the heat dissipation effect is poor.

[0003] In order to solve the above problems, for power devices that generate more heat during operation, the traditional method is to install a heat sink on the heat generating power device, and the heat sink and the power device are fastened together by screws or insulating thermal pads. This method is generally realized manually, and there are defects such as possible damage to power devices, low production efficiency, and more labor.

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