Unlock instant, AI-driven research and patent intelligence for your innovation.

Motherboard protection circuit, method and terminal

A technology for protecting circuits and motherboards, applied in the field of circuits, can solve problems such as motherboard temperature rise and motherboard device damage

Active Publication Date: 2021-11-30
SHENZHEN ITZR TECH
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the chip performs calculations with a large amount of data, the chip will become the main heat-generating component on the motherboard, which will increase the temperature of the motherboard.
If the temperature is too high, it may cause damage to the components on the motherboard.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Motherboard protection circuit, method and terminal
  • Motherboard protection circuit, method and terminal
  • Motherboard protection circuit, method and terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0044] Embodiment, a kind of motherboard protection circuit, such as figure 1 As shown, it includes: a protection thermal component 1, a reference thermal component 2, a threshold comparison unit 3, a differential comparison unit 4 and a power control unit 5.

[0045] Such as figure 1 As shown, the thermal protection components 1 are arranged on the side of the motherboard adjacent to the chip, and there are at least two of them. Preferably, in the present application, there are two protection heat-sensitive components 1, and the two protection heat-sensitive components 1 are respectively disposed on both sides of the chip. The protection thermal component 1 acquires the thermal signal sent by the chip and outputs the thermal protection signal.

[0046] Such as figure 1 As shown, the reference thermal components 2 are arranged on the side of the main board away from the chip, and there are at least two in number. Preferably, in this application, there are two reference the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The application discloses a motherboard protection circuit, a method and a terminal, and relates to the technical field of circuits. Its motherboard protection circuit includes protection thermal components, which are arranged on the side of the motherboard adjacent to the chip, for outputting protection thermal signals; reference thermal components, which are arranged on the side of the motherboard away from the chip, for outputting reference thermal signals ; Threshold value comparison unit, its input terminal respectively receives protection thermal signal and basic temperature threshold value signal, based on comparing protection thermal signal and basic temperature threshold value signal, outputs the first temperature control signal; Differential comparison unit, its input terminal receives protection thermal signal respectively Sensitive signal and reference thermal signal, based on the comparative protection thermal signal and reference thermal signal, output the second temperature control signal; power control unit, which receives the first temperature control signal and the second temperature control signal, controls the mainboard power supply path On or off, this application has the advantage of avoiding damage to components on the main board caused by excessive temperature of the main board.

Description

technical field [0001] The present application relates to the field of circuits, in particular to a motherboard protection circuit, method and terminal. Background technique [0002] The motherboard is the core of the hardware system, and it is also the largest printed circuit board in the terminal equipment. The main function of the motherboard is to transmit various electronic signals. In addition, chips are installed on the motherboard to process data. When the chip performs calculations with a large amount of data, the chip will become the main heat-generating component on the motherboard, which will increase the temperature of the motherboard. And if the temperature is too high, it may cause damage to the components on the motherboard. Contents of the invention [0003] In order to avoid device damage on the main board caused by excessive temperature of the main board, the application provides a main board protection circuit, method and terminal. [0004] In the fi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H02H5/04H02H7/20G06F1/20
CPCG06F1/20H02H5/042H02H7/20
Inventor 徐茜徐朝阳
Owner SHENZHEN ITZR TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More