Hybrid integrated circuit fixing structure for rotary vacuum vapor phase cleaning
A hybrid integrated circuit and fixed structure technology, which is applied in the secondary processing of printed circuits, the assembly of printed circuits with electrical components, the cleaning/polishing of conductive patterns, etc., to improve stability, avoid circuit fixing problems, and ensure stability.
Active Publication Date: 2021-06-04
XIAN MICROELECTRONICS TECH INST
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Problems solved by technology
[0004] Aiming at the problem that hybrid integrated circuits cannot be fixed during rotary vacuum vapor phase cleaning in the prior art, the present invention provides a hybrid integrated circuit fixing structure for rotary vacuum vapor phase cleaning. The fixing structure is simple, easy to use, and universal Strong, meet the fixing of hybrid integrated circuits and movable components of different shapes and sizes, suitable for hybrid integrated circuits of different sizes and specifications, solve the problem of circuit fixing in the process of vacuum vapor phase cleaning of hybrid integrated circuits, and meet the needs of high reliability circuits The need for vacuum vapor cleaning
Method used
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[0032] The present invention will be further described in detail below in conjunction with specific embodiments, which are to explain rather than limit the present invention.
[0033] The invention provides a hybrid integrated circuit fixing structure for rotary vacuum vapor cleaning, such as figure 1 and figure 2 As shown, it includes a circuit casing 5, a frame body 7 and several beams 1 and pressing blocks 3; the two ends of the beams 1 are respectively fixed on the frame body 7, and the circuit casing 5 is in the shape of a hybrid integrated circuit. It is fixed inside the circuit housing 5, the bottom sides of the circuit housing 5 are placed on the beam walls of the adjacent beams 1, the interior of the circuit housing 5 is exposed to the outside, and several pressing blocks 3 are fixedly connected to the beam 1. And the two sides of the pressing block 3 are respectively pressed on both sides of the top of the circuit casing 5, so as to realize the fixing of the circui...
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The invention provides a hybrid integrated circuit fixing structure for rotary vacuum vapor phase cleaning, which is characterized in that a plurality of cross beams are fixedly arranged on a frame body, a circuit shell is U-shaped, so that a hybrid integrated circuit can be conveniently placed in the circuit shell, two sides of the bottom of the circuit shell are lapped on beam walls of adjacent cross beams, and the interior of the circuit shell is exposed outside; vacuum vapor phase cleaning in circuit shell is facilitated, the the circuit shell is fixedly connected to cross beam through the pressing block, and the two ends of the pressing block are pressed on the two sides of the top of the circuit shell respectively, so that the stability of the circuit shell on the cross beam is improved, and the circuit fixing problem in the vacuum vapor phase cleaning process is effectively avoided; and the stability of the hybrid integrated circuit during rotation in vacuum vapor phase cleaning is ensured.
Description
technical field [0001] The invention relates to the technical field of hybrid integrated circuit assembly, in particular to a hybrid integrated circuit fixing structure for rotary vacuum vapor cleaning. Background technique [0002] For fully sealed hybrid integrated circuits, the cleanliness inside the circuit is an important factor affecting the quality of the circuit. Due to the particularity of the soldering process (including reflow soldering and manual soldering), flux is needed to assist in soldering to ensure the reliability of solder joints. Flux contamination after soldering is an unavoidable type of contamination in the production process control. It can only be removed by a cleaning process to ensure the reliability of the circuit. [0003] The vacuum vapor cleaning process can effectively reduce the surface tension of the solvent, improve the fine-pitch cleaning ability, and ensure the effectiveness of post-solder cleaning of hybrid integrated circuits. Compar...
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Login to View More IPC IPC(8): H05K3/34H05K3/26
CPCH05K3/34H05K3/26
Inventor 叶晓飞马雄飞黄栋吕晓云张军李卫卫周乐
Owner XIAN MICROELECTRONICS TECH INST