Electronic device metal wire/spring piece contact pressure full-automatic tester and test method

Abstract

According to the electronic device metal wire/spring piece contact pressure full-automatic tester and the test method, the positions of a plurality of metal wires/spring pieces to be tested are automatically and accurately identified in the field of view of the high-definition industrial camera, the position information is transmitted to the upper computer software, and after an adjustable loading sliding table is controlled to accurately move to the pressure test position, and then a hook of the programmable digital dynamometer is triggered to move downwards to accurately align at the position of the metal wire/spring piece, the metal wire/spring piece is automatically hung one by one, data measured by the dynamometer is returned to upper computer software, and a pressure value of a contact point is automatically calculated by combining a pressure calculation algorithm. According to the method, an automatic test function is realized, and the single measurement time of a single metal wire/leaf spring is less than 15s; measuring precision is high, precision in the tension range is +/-0.05 gf, meanwhile, maintenance and installation are convenient, and the overload protection function is achieved.

Description

technical field [0001] The invention belongs to the field of testing the mechanical properties of tiny components, and in particular relates to a fully automatic tester and a test method for contact pressure of metal wires / spring sheets of electronic devices. Background technique [0002] In existing electronic products, some electronic products need to use groups of tiny metal wires / springs to press the metal substrate to conduct two circuits in order to transmit electrical signals. Among them, the pressing force of the metal wire / spring on the metal substrate determines the contact area of ​​the contact, and also determines the electrical conductivity and working performance of the entire electronic product. Therefore, the pressing force of the metal wire / spring on the metal substrate is determined. Precise testing is particularly important. [0003] The traditional test method is to connect the electronic product in a conducting circuit, pull the free end of the metal wi...

AI Technical Summary

Problems solved by technology

[0004] However, the existing tensile test method has the following defects: the test accuracy and stability are not enough by using the calibrated spring test

When multiple metal wires / springs are tested in groups, it is necessary to manually pick up, test, record and process data one by one, and form a report. The test efficiency is extremely low, which is not conducive to the liberation of labor.

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