Unlock instant, AI-driven research and patent intelligence for your innovation.

Transfer component, transfer device and transfer method

A technology of transfer components and transfer devices, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of imperfect transfer schemes of micro components, achieve the effects of reducing transfer times, improving transfer efficiency, and reducing damage

Active Publication Date: 2021-06-15
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
View PDF17 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the deficiencies in the above-mentioned related technologies, the purpose of this application is to provide a transfer member, a transfer device and a transfer method, aiming to solve the problem of incomplete micro-element transfer solutions in the related technologies

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transfer component, transfer device and transfer method
  • Transfer component, transfer device and transfer method
  • Transfer component, transfer device and transfer method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0028] In the related technology, from the growth substrate to the display backpl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a transfer component, a transfer device and a transfer method. The transfer component comprises a control unit and an arm unit; the control unit is configured to apply an acting force to the arm unit in response to an external control signal; the arm unit is connected with the control unit; xthe arm unit is configured to respond to the acting force to perform clamping operation, loosening operation and overturning operation in a clamping state on a micro-component. According to the transfer component, the transfer device and the transfer method, the transfer component can be used for clamping the micro-component from a to-be-transferred substrate, overturning the micro-component and then placing the micro-component on a receiving substrate, so that the micro-component is transferred from the to-be-transferred substrate to the receiving substrate, and overturning of the micro-component is realized, and therefore, only one-time transfer is needed, and related transfer techniques for the micro-component are improved.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a transfer member, a transfer device and a transfer method. Background technique [0002] Micro components include but are not limited to semiconductor devices, such as Micro Light Emitting Diodes (Micro-LEDs), which usually require complex and harsh manufacturing processes, and also involve the problem of mass transfer. [0003] Taking Micro-LED as an example, Micro-LED is a new generation of display technology. Compared with the existing liquid crystal display, it has higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption. It can be combined with a flexible panel to realize a flexible display. The Micro-LED display backplane includes several pixel areas, and each pixel area includes a red LED chip, a blue LED chip, and a green LED chip. In the production process of the display backplane, it is first necessary to fabricate red, gre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67H01L21/683H01L27/15H01L33/48
CPCH01L21/67144H01L21/6835H01L33/486H01L27/156H01L2933/0033H01L2221/68313
Inventor 汪庆许时渊范春林王斌
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com