An all-inorganic package high-power LED device and its manufacturing method
An LED device, high-power technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as inability to meet integration, and achieve the effects of improving heat dissipation performance, simple manufacturing method, and increasing heat dissipation area
Active Publication Date: 2022-02-11
HGC (WUHAN) TECH CO LTD
View PDF10 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The invention provides an all-inorganic packaged high-power LED device and a manufacturing method thereof, to solve the problem that the method of improving the heat dissipation performance of the LED device by using a material with high thermal conductivity in the prior art cannot meet the requirements of high integration and high power. Heat dissipation requirements for UV LED devices
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0042]In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0043] figure 1 A schematic flow chart of a method for making an all-inorganic package high-power LED device according to an embodiment of the present invention, figure 2 Yes figure 1 The LED device edge corresponding to each step in the method shown image 3 Schematic diagram of the cross-sectional structure in the direction of A-A in the middle, image 3 Yes figure 2 Schematic diagram of the top view structure of the middle substrate, Figure 4 Yes figure 2 Schematic diagram of the upward structure of the middle dam, Figure 5 Yes figure 1 Schematic diagram of the fabrication p...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the technical field of LED packaging, and provides an all-inorganic packaging high-power LED device and a manufacturing method thereof. The manufacturing method includes: making a support including a base plate and a dam: making two through-hole components penetrating the base plate and distributed symmetrically at intervals in the non-dam-covered area of the base plate, and making a connection between the through-hole components in the dam and the base plate The heat transfer channel is used to form two receiving cavities symmetrically spaced apart on the bracket; then the first pair of pads and the second pair of pads are respectively fabricated on the corresponding positions of the substrate; the bracket is sintered by using a high-temperature co-fired ceramic process; Make a heat conduction structure in the storage cavity: first form a metal capillary structure in the storage cavity, then vacuumize, inject refrigerant liquid, and finally seal; weld the LED chip on the first pad pair; weld the cover plate on the dam superior. The manufacturing method provided by the invention is simple and easy to realize, and the heat dissipation performance is significantly improved by increasing the heat dissipation area of the LED device, and is suitable for making high-power LEDs.
Description
technical field [0001] The invention relates to the technical field of LED packaging, and more specifically relates to an all-inorganic packaging high-power LED device and a manufacturing method thereof. Background technique [0002] The electro-optical conversion efficiency of UV LED is low, and most of the energy is converted into heat and emitted. UV LED junction temperature requirements are high, and heat decay is fast. Therefore, copper-clad aluminum nitride ceramic brackets with high thermal conductivity are mostly used in the industry at present (the thermal conductivity of copper is 377W / m K, and the single crystal theory of aluminum nitride ceramics The thermal conductivity is above 170W / m·K) to improve the heat dissipation performance of the device. With the development of the UV LED industry and the increasingly high requirements of its products, the application of UV LED devices with higher power, lower thermal resistance, and higher reliability will be the futu...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/64
CPCH01L33/483H01L33/648H01L33/62
Inventor 葛鹏孙雷蒙杨丹
Owner HGC (WUHAN) TECH CO LTD