Heat dissipation device of electronic and electrical equipment
A heat dissipation device, electronic and electrical technology, which is applied to the structural parts of electrical equipment, electrical components, and decoration through conduction heat transfer, etc. Non-uniform material dispersion, uniform heat dissipation effect, and convenient operation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] A heat dissipation device for electronic and electrical equipment, characterized in that it includes a heat dissipation cavity 1 and a cooling pipe 6; the heat dissipation cavity 1 has a cuboid structure, and the top surface of the heat dissipation cavity 1 is connected to the top cover 3 through a movable connection structure 2 to dissipate heat The chamber 1 has a double-layer structure, and a heat dissipation groove 4 is formed between the outer wall and the inner wall of the heat dissipation chamber 1. Several uniformly arranged ventilation holes 5 are arranged on the inner wall of the heat dissipation chamber 1. The bottom surface of the heat dissipation chamber 1 is provided with There are several evenly arranged cooling holes 14;
[0032] The heat dissipation cavity 1 is made of high thermal conductivity silica gel material, which is obtained by compounding organic silica gel and heat conduction material; the heat conduction material is composed of heat conduction...
Embodiment 2
[0049] A heat dissipation device for electronic and electrical equipment, characterized in that it includes a heat dissipation cavity 1 and a cooling pipe 6; the heat dissipation cavity 1 has a cuboid structure, and the top surface of the heat dissipation cavity 1 is connected to the top cover 3 through a movable connection structure 2 to dissipate heat The chamber 1 has a double-layer structure, and a heat dissipation groove 4 is formed between the outer wall and the inner wall of the heat dissipation chamber 1. Several uniformly arranged ventilation holes 5 are arranged on the inner wall of the heat dissipation chamber 1. The bottom surface of the heat dissipation chamber 1 is provided with There are several evenly arranged cooling holes 14;
[0050] The heat dissipation cavity 1 is made of high thermal conductivity silica gel material, which is obtained by compounding organic silica gel and heat conduction material; the heat conduction material is composed of heat conduction...
Embodiment 3
[0067] A heat dissipation device for electronic and electrical equipment, characterized in that it includes a heat dissipation cavity 1 and a cooling pipe 6; the heat dissipation cavity 1 has a cuboid structure, and the top surface of the heat dissipation cavity 1 is connected to the top cover 3 through a movable connection structure 2 to dissipate heat The chamber 1 has a double-layer structure, and a heat dissipation groove 4 is formed between the outer wall and the inner wall of the heat dissipation chamber 1. Several uniformly arranged ventilation holes 5 are arranged on the inner wall of the heat dissipation chamber 1. The bottom surface of the heat dissipation chamber 1 is provided with There are several evenly arranged cooling holes 14;
[0068] The heat dissipation cavity 1 is made of high thermal conductivity silica gel material, which is obtained by compounding organic silica gel and heat conduction material; the heat conduction material is composed of heat conduction...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com