A Time-Pressure Intelligent Control Method Based on Colloid Remaining Quantity

Abstract

The present invention relates to the technical field of glue volume control, in particular to a time-pressure intelligent control method based on the remaining volume of colloid, which includes the following steps: S1: start the adjustment of the remaining glue volume, open the expiratory channel of the solenoid valve, increase the air pressure in the needle tube, and the controller The voltage value increases; S2: According to the proportional relationship between the glue discharge time and the partial differential value of the voltage function and the remaining glue in the tube, calibrate the remaining glue amount; S3: Establish the current remaining glue amount, dispensing time, discharge pressure and discharge glue volume Between the models, predict the value of glue spit out. By detecting the glue-out time and voltage value under different remaining glue amounts, and calculating the glue-out amount through model calculation, the dispensing time and the remaining amount of glue are digitally displayed. This method is simple and convenient to adjust, and has good consistency. Ensure consistent glue output during each dispensing operation, so as to ensure stable dispensing effect and precise glue output.

Description

technical field [0001] The invention relates to the technical field of glue amount control, in particular to a time-pressure intelligent control method based on the remaining amount of glue. Background technique [0002] Glue dispensing is a very important process in the microelectronics packaging industry. It is widely used in integrated circuit packaging and surface mount. It seems simple to dispense a certain amount of glue on the workpiece. However, because the dispensing process involves gas, liquid, etc. A variety of media, the adhesive used is non-Newtonian fluid, its complex and changeable properties make it difficult to guarantee the performance and quality of dispensing. [0003] The time-pressure method is currently the most widely used dispensing technology in the packaging process, but its accuracy is not high; from the perspective of control, the semiconductor packaging process has some characteristics: the process is multivariable, nonlinear, strongly coupled,...

AI Technical Summary

Problems solved by technology

[0005] The dispensing process is traditionally an open-loop control. At present, the control of the glue output under the remaining glue amount in the market is mainly adjusted according to experience. This adjustment method is time-consuming and cannot achieve good consistency of each glue output.

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