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Ultrafast laser micropore rotary-cut machining device

A processing device and ultrafast laser technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of laser incidence angle control accuracy, microhole taper problem, and the inability to realize large depth-to-diameter ratio microhole processing, etc. problems, to achieve the effect of improving motion control accuracy, good directionality, and eliminating processing errors

Active Publication Date: 2021-06-18
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide an ultra-fast laser microhole rotary cutting processing device in view of the above-mentioned defects of the prior art, which overcomes the taper problem of the microhole in the prior art, the problem of the control accuracy of the laser incident angle and the inability to realize Defects of Microhole Machining with Large Depth to Diameter Ratio

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  • Ultrafast laser micropore rotary-cut machining device
  • Ultrafast laser micropore rotary-cut machining device
  • Ultrafast laser micropore rotary-cut machining device

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Embodiment Construction

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0031] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The invention belongs to the technical field of laser machining, and particularly relates to a Bessel laser beam rotary-cut punching device based on a Dove prism. An ultrafast laser rotary-cut punching device comprises an ultrafast laser, a laser beam energy distribution conversion system, a laser incidence direction adjusting system, a laser polarization state balance system, a rotary optical system, a balance optical system and a Bessel laser beam dynamic focusing system, wherein the laser incidence direction adjusting system is composed of three wedge-shaped prisms, so that the machining precision is greatly improved while the low machining cost is kept; the laser beam energy distribution conversion system and the Bessel laser beam dynamic focusing system are combined to form a Bessel beam realization system suitable for the Dove prism; and in addition, the Bessel beam is used for conducting laser rotary-cut micropore machining, so that compared with an existing micropore machining mode, the precision of a machined micropore is effectively improved, the taper controllability of the micropore is improved, and the depth-diameter ratio of the machined micropore is increased.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a rotary cutting and drilling device based on a Bessel ultrafast laser beam of a Dove prism. Background technique [0002] With the development of manufacturing technology and microfluidic technology, micropores or micropore arrays with diameters of tens or hundreds of microns are widely used in many fields such as aerospace, energy, automobile manufacturing, etc., and with the improvement of related performance requirements, its The size, precision, shape and aspect ratio of micropore manufacturing put forward higher-level requirements. Traditional machining methods such as machining, electrical discharge machining, and electrochemical machining are no longer suitable for today's requirements for micro-hole manufacturing due to the limitations of machining size, material selectivity, and precision. Compared with traditional machining methods, laser machining...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/064B23K26/06
CPCB23K26/06B23K26/0652B23K26/382
Inventor 张震杨伟管迎春
Owner TSINGHUA UNIV