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Ceramic device and preparation method thereof

A technology for ceramics and devices, applied in the field of ceramic devices and their preparation, can solve the problems of low dimensional accuracy, large shrinkage rate, sintering deformation, etc., and achieve the effects of high surface flatness and strong shrinkage ability

Inactive Publication Date: 2021-06-18
ANHUI TATFOOK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application provides a ceramic device and its preparation method to solve the technical problems of traditional ceramic materials such as large shrinkage, easy deformation due to sintering, low dimensional accuracy, and poor flatness

Method used

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  • Ceramic device and preparation method thereof
  • Ceramic device and preparation method thereof
  • Ceramic device and preparation method thereof

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preparation example Construction

[0014] An embodiment of the present application provides a method for preparing a ceramic device, comprising the following steps:

[0015] S101 : pressing the ceramic material into a ceramic green body 100 .

[0016] Specifically, a ceramic material is put into a mold, and the ceramic material is pressed into a ceramic green body 100 under a predetermined pressure. Wherein, the predetermined pressure is 120MPa˜160MPa, for example, 120MPa, 130MPa, 140MPa, 150MPa or 160MPa, etc., which is not limited here. The ceramic material in this embodiment includes Al 2 o 3 , MgO, La 2 o 3 , in other embodiments, the preparation method of the ceramic device is applicable to most ceramic materials.

[0017] Specifically, the ceramic material is Al 2 o 3 , MgO, La 2 o 3 Mixed and ground composite powder. In other embodiments, the ceramic material is a composite powder formed by mixing and grinding a ceramic matrix and glass powder, wherein the ceramic matrix is ​​Al 2 o 3 , MgO, ...

Embodiment 1

[0070] The ceramic matrix in the microwave dielectric ceramic material provided by this embodiment is 22Al 2 o 3 -3MgO-2La 2 o 3 , the glass powder is Al 2 o 3 -SiO 2 -B 2 o 3 , and the quality of the glass powder accounts for 0.25% of the mass of the ceramic matrix, and the Al with a purity of more than 99% 2 o 3 , MgO, La 2 o 3 , SiO 2 and B 2 o 3 As the starting material, and prepared by the following process steps.

[0071] A. First prepare the ceramic matrix material, according to the general chemical formula 22Al 2 o 3 -3MgO-2La 2 o 3 , calculate the quality of each raw material needed, the raw material adopts analytical pure, the MgO of 99wt% and the La of 99.9wt% 2 o 3 and Al 2 o 3 ;

[0072] B. Pour the accurately weighed raw materials into the ball mill tank, add deionized water and ZrO 2 Grinding balls; the weight ratio of the three is: material: balls: deionized water = 1:2:1.5; ball milling for 4 hours, after mixing evenly, discharge the mat...

Embodiment 2

[0087] The ceramic matrix in the microwave dielectric ceramic material provided by this embodiment is 22Al 2 o 3 -3MgO-2La 2 o 3 , the glass powder is ZnO-SiO 2 -B 2 o 3 , and the quality of the glass powder accounts for 0.10% of the mass of the ceramic matrix, and the Al with a purity of more than 99% 2 o 3 , MgO, La 2 o 3 , ZnO, SiO 2and B 2 o 3 As the starting material, and prepared by the following process steps.

[0088] A. First prepare the ceramic matrix material, according to the general chemical formula 22Al 2 o 3 -3MgO-2La 2 o 3 , calculate the quality of each raw material needed, the raw material adopts analytical pure, the MgO of 99wt% and the La of 99.9wt% 2 o 3 and Al 2 o 3 ;

[0089] B. Pour the accurately weighed raw materials into the ball mill tank, add deionized water and ZrO 2 Grinding balls; the weight ratio of the three is: material: balls: deionized water = 1:2:1.5; ball milling for 4 hours, after mixing evenly, discharge the materia...

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Abstract

The invention discloses a ceramic device and a preparation method thereof. The preparation method of the ceramic device comprises the following steps: pressing a ceramic material into a ceramic green body; placing high-sintering-temperature green body blocks on the two opposite outer surfaces of the ceramic green body in an attached mode, and sintering the ceramic green body and the high-sintering-temperature green body blocks together, wherein the sintering temperature of the high-sintering-temperature green body blocks is higher than that of the ceramic green body; and after sintering is completed, removing the high-sintering-temperature green block so as to obtain a sintered ceramic device. The ceramic material comprises a ceramic matrix, and the ceramic material comprises Al2O3, MgO and La2O3. In the sintering process, when the sintering temperature reaches the sintering temperature of the ceramic green body and does not reach the sintering temperature of the high-sintering-temperature green body block, the high-sintering-temperature green body block hinders shrinkage of the ceramic green body in the sintering process, and the surface flatness of a ceramic device obtained after the ceramic green body is sintered is high.

Description

technical field [0001] The application belongs to the technical field of ceramic material preparation, and in particular relates to a ceramic device and a preparation method thereof. Background technique [0002] Microwave dielectric ceramic material is a new type of functional electronic ceramic, which has the characteristics of high dielectric constant, low loss, and small frequency temperature coefficient. This microwave dielectric ceramic material can be used to make dielectric resonators, duplexers, dielectric filters, etc. Devices are widely used in many fields such as mobile communication base stations, repeaters, radars, satellite positioning and navigation systems, etc., to meet the needs of high-performance indicators such as miniaturization and low loss of filter units in the antenna feeder system of the above-mentioned base stations. [0003] Generally speaking, the shrinkage rate of microwave dielectric ceramic materials for 5G base stations is about 15-20%. Du...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/64C03C12/00C03C6/04
CPCC04B35/10C04B35/64C03C12/00C03C1/00C04B2235/3206C04B2235/3227C04B2235/365C04B2235/6562C04B2235/6567C04B2235/963
Inventor 陆正武袁亮亮
Owner ANHUI TATFOOK TECH CO LTD
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