A stable crystal-bonding method for diodes

A diode and stable technology, which is applied in the field of stable die bonding of diodes, can solve the problems that the solder paste is easy to overflow around and affect the reliability of the internal structure of the diode, and achieve a coherent and reliable processing process, stable and reliable internal structure, and stable and reliable shape. Effect
CN112992700BActive Publication Date: 2021-09-28先之科半导体科技(东莞)有限公司
11 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
先之科半导体科技(东莞)有限公司
Publication Date
2021-09-28

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides a stable crystal-bonding method for a diode, which comprises the following steps: preheating the first jig; limiting and pressing, pressing the insulating limiting ring on the upper surface of the first pin; once spraying, insulating limiting The inner wall of the bit ring forms the first particle layer; glue is dispensed at one time; the chip is attached, and the chip is pressed against the plastic conductive material on the first pin; the limit moves upward, and the first particle layer adheres to the first molding around the layer; first curing; second spraying, the inner wall of the insulating limit ring forms a second particle layer; second dispensing; sticking the top pin, pressing the second pin on the insulating limit ring; ring separation, the second The second particle layer is adhered to the surrounding of the second shaping layer; secondary curing. The invention can effectively limit the shapeable conductive material through the insulating limit ring, and the particle layer formed by the conductive particles can ensure the stable and reliable shape of the plastic layer before curing, and the finally obtained internal structure of the diode is stable and reliable.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to diode processing, and specifically discloses a stable crystal-fixing method for diodes. Background technique

[0002] When a forward bias voltage is applied, the diode forms a conduction effect, and when the actual reverse bias voltage is applied, the diode forms a blocking effect. The packaging of the diode includes an in-line packaging structure and a chip packaging structure.

[0003] SMD diodes are mainly used in microelectronic products. SMD diodes mainly include an insulating package, a chip and two pins. During production, the two pins are soldered to the two poles of the chip through solder paste, and then injected The package is processed and molded. During the die-bonding process, the solder paste adheres between the chip and the pins. Due to the effect of compression, the solder paste is easy to overflow to the surroundings, which affects the reliability of the internal structure of the diode. Contents of the inven...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More