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Light source packaging structure, packaging technology and LED bulb

A packaging structure and light source technology, applied in the field of lighting, can solve problems such as heat dissipation defects of LED lamps, and achieve the effects of large power controllable range, small size, and improved heat dissipation effect

Pending Publication Date: 2021-06-18
安徽杭科光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a new packaging structure for LED lamps, which solves the problem of heat dissipation defects of LED lamps in the prior art

Method used

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  • Light source packaging structure, packaging technology and LED bulb
  • Light source packaging structure, packaging technology and LED bulb
  • Light source packaging structure, packaging technology and LED bulb

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Such as figure 1 As shown, a light source package structure includes a light-transmitting first package shell 101 and a second package shell 102, the first package shell 101 and the second package shell 102 are connected to form a sealed cavity A, and the sealed cavity A is filled with a heat conducting liquid or a heat conducting gas; a light source is provided in the sealed cavity A, and the light source includes conductive pins 103 , and the conductive pins protrude from the sealed cavity A to the outer space of the sealed cavity A.

[0050] Grooves 104 are provided on the inner surfaces of the first packaging case 101 and the second packaging case 102 . The outer surfaces of the first packaging case 101 and the second packaging case 102 are smooth surfaces. The grooves and protrusions can be evenly distributed or regularly unevenly distributed.

[0051] In other executable embodiments, protrusions are provided on the inner surfaces of the first packaging case 101 ...

Embodiment 2

[0071] An LED light source encapsulation process, which is used to manufacture the light source encapsulation structure described in Embodiment 1, said process comprising the following steps:

[0072] setting a valve in the first packaging case or the second packaging case;

[0073] Fill fluorescent glue on the inner surfaces of the first packaging case and the second packaging case, and dry them;

[0074] The intermediate ring 105 is placed between the first packaging case and the second packaging case, and the first packaging case, the second packaging case and the intermediate ring 105 are sealed and fixed by a sealing process to form a sealed cavity;

[0075] The sealed chamber is vacuumed through the valve and then filled with heat-conducting gas or liquid, and then the valve is sealed.

[0076] Wherein, the conductive pins are integrally formed by injection molding to form the intermediate ring 105 .

[0077] Specifically, the sealing process adopts ultrasonic sealing,...

Embodiment 3

[0079] An LED light bulb, comprising at least one light source encapsulation structure described in Embodiment 1, a sealed bulb is provided outside the light source encapsulation structure, a sealed cavity B is formed between the bulb and the light source encapsulation structure, the The sealed chamber B is filled with heat-conducting gas or heat-conducting liquid. It also includes a stem, a lamp cap and a conductive wire, the lamp cap and the stem are connected to the bulb, the lamp cap is used to connect to an external power supply, the conductive wire is connected to the lamp cap and the stem, and the conductive wire of the light source packaging structure The pins are connected to the conductive wires.

[0080] In one application implementation, the sealed cavity A can be considered as a cavity for placing the light source, and the sealed cavity B formed by the bulb is a protective cavity or a secondary heat dissipation cavity.

[0081] Such as Figure 6-9 Four light sou...

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Abstract

The invention discloses a light source packaging structure, a packaging process and an LED bulb. The light source packaging structure comprises a first light-transmitting packaging shell and a second light-transmitting packaging shell, wherein the first packaging shell and the second packaging shell are connected to form a sealing cavity A, and the sealing cavity A is filled with heat conduction liquid or heat conduction gas; a light source is arranged in the sealing cavity A and comprises a conductive pin, and the conductive pin extends out of the sealing cavity A to the outer space of the sealing cavity A; and uniformly distributed grooves are formed in the inner surfaces of the first packaging shell and the second packaging shell. The invention provides a novel LED lamp packaging structure, and solves a problem of heat dissipation defects of an LED lamp in the prior art, and meanwhile, the concept design of the light engine is adopted, a basis is provided for various applications of the LED bulb lamp, and defects of cost and lighting effect of the current common bulb lamp are overcome.

Description

technical field [0001] The invention belongs to the technical field of lighting, and in particular relates to a light source package structure and a package process and an LED bulb based on the package structure. Background technique [0002] Light-emitting diodes (Light-Emitting Diode, referred to as "LED") are widely used in display, general lighting and other fields due to their characteristics of energy saving, environmental protection, long life, and small size. The technology of the LED industry is becoming more and more mature, the application is becoming wider and wider, the market demand is large, and it is gradually replacing the traditional high-voltage halogen lamps, tungsten lamps, and even energy-saving lamps to achieve real energy-saving and emission-reducing greening of the earth. At present, in order to meet the needs of different application fields, LED packaging technology is constantly improving, and the form of LED light source is becoming more and more ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/50H01L33/58F21K9/232F21K9/237F21K9/238F21K9/65F21Y115/10
CPCH01L33/48H01L33/64H01L33/502H01L33/58F21K9/232F21K9/237F21K9/238F21K9/65F21Y2115/10
Inventor 严钱军郑昭章马玲莉
Owner 安徽杭科光电有限公司
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