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Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface

A technology of micro-electro-mechanical devices, which is applied in the technical field of manufacturing optical micro-electro-mechanical devices with tiltable structures by using anti-reflection surfaces, and can solve problems such as operating defects of micro-electro-mechanical devices

Pending Publication Date: 2021-06-22
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0039] Furthermore, the use of a protective cover 51 made of plastic in the rear end may easily lead to alignment problems with the MEMS device 20 , especially between the opening 53 of the protective cover 51 and the tiltable structure 22 of the sensor body 50 . alignment problems, resulting in operating defects of MEMS devices

Method used

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  • Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface
  • Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface
  • Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface

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Experimental program
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Embodiment Construction

[0066] The following describes the steps used to fabricate microelectromechanical devices (in particular mirror devices obtained using MEMS technology) that can be used in pico-projectors and that can be inserted in mobile devices (in particular mobile phones and augmented reality and virtual reality viewers).

[0067] In particular, the fabrication steps described below allow to obtain MEMS devices with similar figure 2 with image 3 The structure shown in , and the general structure described briefly below (but with substantial improvements). In particular, Figure 4 , Figure 5A to Figure 5H with Figure 6 to Figure 9 means along with figure 2 The line III-III corresponds to the section line intercepted by the intermediate structure.

[0068] Figure 4 Shown is an SOI wafer 90 that has a first surface 100A and a second surface 100B and includes a first structural layer 90A and a second structural layer 90B made, for example, of silicon, and a layer of silicon oxide...

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Abstract

The invention relates to a process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface. For manufacturing an optical microelectromechanical device, a first wafer of semiconductor material having a first surface and a second surface is machined to form a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements which extend between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. A second wafer is machined separately to form a chamber delimited by a bottom wall having a through opening. The second wafer is bonded to the first surface of the first wafer in such a way that the chamber overlies the actuation structure and the through opening is aligned to the suspended mirror structure. Furthermore, a third wafer is bonded to the second surface of the first wafer to form a composite wafer device. The composite wafer device is then diced to form an optical microelectromechanical device.

Description

[0001] priority claim [0002] This application claims the benefit of priority to Italian Patent Application No. 102019000025042 filed on December 20, 2019, the contents of which are hereby incorporated by reference in their entirety to the fullest extent permitted by law. technical field [0003] The present disclosure relates to a process for fabricating an optical microelectromechanical device with a tiltable structure using an anti-reflective surface. In particular, the following will refer to the fabrication of micromirrors using MEMS (Micro-Electro-Mechanical Systems) technology. Background technique [0004] It is well known that micromirrors can be produced starting from semiconductor materials. Indeed, the small size of MEMS semiconductor devices enables said devices to be integrated in portable devices for optical applications such as augmented and virtual reality viewers, portable computers, laptops, notebooks, PDAs, tablets, mobile phones and smartphones. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B81B7/02G03B21/28G02B26/10G02B26/08
CPCB81C1/00134B81B7/02G03B21/28G02B26/10G02B26/0833B81B2201/042G02B26/0858B81B2203/058B81B2203/0163B81B2201/032B81C2203/0154B81C1/00317B81B3/007B81C2203/036B81B3/0021B81C1/0069B81C2201/013B81C2201/0156
Inventor L·塞吉齐N·博尼L·奥吉欧尼R·卡尔米纳蒂M·卡米纳蒂
Owner STMICROELECTRONICS SRL