PCB (Printed Circuit Board) and potential connection side surface metallization process thereof
A PCB board and metallization technology, which is applied in the field of metallization technology on the side of the PCB board and its potential connection, can solve the problems affecting the normal operation of the circuit board, the separation of the copper layer from the circuit board, etc., and achieve a simple manufacturing method and high production efficiency. Effect
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[0038] Contraction below Figure 1-5 Further detailed description of the present application.
[0039] First aspect: The present application discloses a PCB board.
[0040] Refer Figure 5 One PCB plate includes a substrate 1, a substrate 1, respectively disposed on two line layers 11 on the opposite sides of the substrate 1, and a connecting member connected to the two line layers 11, in this embodiment, connected The part is connected to the two line layers 11 relative to the two line layers 11 opposite to the two line layers 11 relative to the first plating layer 5, and the first plating layer 5 is attached to one end side wall of the socket.
[0041] In a second aspect, the present application discloses a PCB plate electrode side metalization process.
[0042] PCB plate potential side metalization process, reference figure 1 It includes the following steps.
[0043] S1, open hole: The bore bore 2 through the base material 1 is provided through the number of control machines 1, a...
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