Novel gluing device for computer mainboard processing

Abstract

The invention relates to the technical field of computers, and discloses a novel gluing device for computer mainboard processing. The novel gluing device comprises a shell, wherein a fixed shaft is fixedly connected to the inner wall of the shell; a glue slot is formed in the inner wall of the shell; a roller shaft is movably connected to the inner wall of the shell and is close to the outer side of the fixed shaft; a sliding block is elastically connected to the inner wall of the roller shaft; a dielectric board is fixedly connected to the inner wall of the sliding block; a pressing plate is fixedly connected to the outer side of the dielectric board; and a ball is movably connected to the outer side of the dielectric board. According to the novel gluing device disclosed by the invention, through movement of the dielectric board, adoption of a way of periodically controlling a valve is avoided, the phenomenon that the head part and the tail part of the mainboard are not glued when the computer mainboard is glued and the computer mainboard needs to be sprayed again can be avoided, and therefore, the time and the labor are saved, the manufacturing cost of spraying of the computer mainboard is reduced, and the gluing production efficiency of the computer mainboard is improved.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a new type of gluing device for computer motherboard processing. Background technique [0002] The main board of the computer is installed in the case, which is one of the most basic and important components of the computer. The main board is generally a rectangular circuit board. As far as the processing of the main board of the computer is concerned, it is necessary to apply glue to the main board of the computer. The existing gluing device During use, there will be a phenomenon that the head and tail of the computer motherboard are not glued. [0003] During the use of the existing computer motherboard gluing device, the method of periodically controlling the valve is often used, resulting in the phenomenon that the head and tail of the computer motherboard are not glued when the computer motherboard is glued, causing the computer motherboard to be re-sprayed, which is time-...

AI Technical Summary

Problems solved by technology

[0003] During the use of the existing computer motherboard gluing device, the method of periodically controlling the valve is often used, resulting in the phenomenon that the head and tail of the computer motherboard are not glued when the computer motherboard is glued, causing the computer motherboard to be re-sprayed, which is time-consuming and laborious. , increasing the manufacturing cost of computer motherboard spraying and reducing the production efficiency of computer motherboard glue coating

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