Unlock instant, AI-driven research and patent intelligence for your innovation.

Sticking device

A sticking and fixture technology, applied in the field of semiconductor processing equipment, can solve problems such as crystals not meeting the requirements and prone to errors, and achieve the effect of facilitating rounding operations, accurate and reliable positions, and ensuring accuracy

Active Publication Date: 2021-06-25
HUNAN SANAN SEMICON CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The sticking of jigs during spheronization is done manually, which is very easy to produce errors, resulting in the crystals after spheronization not meeting the requirements.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sticking device
  • Sticking device
  • Sticking device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0035] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a sticking device. The sticking device comprises an operation room, a first positioning mechanism, a second positioning mechanism, a gluing mechanism and a picking mechanism, wherein the first positioning mechanism is connected with the operation room and used for positioning a silicon carbide crystal; the second positioning mechanism is connected with the operation room and used for positioning a second jig; the gluing mechanism is connected with the operation room and used for applying an adhesive to the first jig and the second jig; the picking mechanism is connected with the operation room and used for conveying the first jig and the second jig to the gluing mechanism, can stick the glued second jig to the silicon carbide crystal to form a semi-finished product, and can convey the semi-finished product to the second positioning mechanism so as to position the second jig through the second positioning mechanism; and the picking mechanism is further used for sticking the glued first jig to the semi-finished product. The sticking device has the advantages of high automation degree, small errors in the sticking process, high sticking quality, and contribution to the follow-up rounding procedure.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to a pasting device. Background technique [0002] As a representative material in the third generation of semiconductors, silicon carbide is widely used in the preparation of power switching devices, microwave devices, Sensors, high temperature integrated circuits. In addition, with the development of the information transmission field and the electric vehicle industry, the demand for silicon carbide devices is showing an upward trend. During the device preparation process, the grown silicon carbide crystal cannot be used directly, and needs to go through dozens of processes to become a semiconductor device that meets the application requirements. However, silicon carbide is a hard and brittle material with a Mohs strength of 9.5, second only to diamond, which makes its processing much more difficult than silicon. Among a series of processing techniques, roundin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/91F16B11/00
CPCB65G47/91F16B11/006Y02P70/50
Inventor 许益民张洁林武庆苏双图
Owner HUNAN SANAN SEMICON CO LTD