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Conductive material forming process

A molding process and technology of conductive materials, applied in the manufacture of circuits, electrical components, cables/conductors, etc., can solve the problems of low processing efficiency of conductive sponge, and achieve the effect of preventing cutting, saving materials, and conveying the bottom film accurately.

Active Publication Date: 2021-06-25
东莞市绿辉智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to improve the problem of low processing efficiency of conductive adhesive tape and manual paste of conductive sponge, this application provides a conductive material forming process, which has the effect of high processing efficiency of pasted conductive sponge

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Embodiment 1 of the present application discloses a conductive material forming process.

[0048] refer to figure 1 and figure 2 , the conductive material forming process includes the following steps,

[0049] Step 1: The conductive adhesive plaster 1 is attached to the bottom film 2, and the conductive adhesive plaster 1 is peeled off the self-contained release paper 11 through the cooperation of the first roller 81 and the first reduction motor 82, and then pasted on the bottom film 2, and passed through two The first roller 51 is arranged opposite to form the conductive adhesive plaster 1 and the bottom film 2 to be pressed together, so that the conductive adhesive plaster 1 and the bottom film 2 are bonded; at the same time, the bottom film 2 carries the conductive adhesive plaster 1 and is transported to the next process.

[0050] Preferably, one of the two first rollers 51 is a driving roller, and the other is a driven roller, and the driving roller is driven b...

Embodiment 2

[0068] Embodiment 2 of the present application discloses a conductive material forming process, which is different from Embodiment 1 in that, refer to Figure 4 , in step 2, the width of the diaphragm 3 is smaller than the width of the isolation region 13, and the side of the diaphragm 3 facing the pasting region 12 is aligned with the joint between the pasting region 12 and the isolation region 13, so that the isolation region 13 faces one end of the pasting region 12 to realize The isolation effectively saves the materials used for the diaphragm 3 and effectively saves the production cost.

Embodiment 3

[0070] Embodiment 3 of the present application discloses a conductive material forming process, which is different from Embodiment 1 in that, refer to Figure 5 , the width of the bottom film 2 is greater than the width of the conductive adhesive plaster 1, the conductive adhesive plaster 1 is attached to the middle position of the bottom film 2, and the edges of both sides of the bottom film 2 are provided with positioning holes 21. Positioning, effectively improving the accuracy of bottom membrane 2 transmission.

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Abstract

The invention relates to the technical field of conductive adhesive tape processing, in particular to a conductive material forming process. The conductive material forming process comprises the following steps: step 1, attaching a conductive adhesive tape to a bottom film; step 2, padding diaphragms, wherein the conductive adhesive tape comprises a pasting area and isolation areas, the pasting area is located in the middle of the conductive adhesive tape, the isolation areas are located on the two sides of the pasting area, and two diaphragms with sizes equal to the sizes of the isolation areas are stacked in the isolation areas respectively and then pressed; step 3, stacking a conductive sponge adhesive tape, stacking the conductive sponge adhesive tape larger than the pasting area in the pasting area, and stacking the part, beyond the pasting area, of the conductive sponge adhesive tape on the diaphragms; step 4, punching and removing the part, beyond the pasting area, of the conductive sponge adhesive tape; and step 5, pasting the conductive sponge adhesive tape and the conductive adhesive tape, and pasting the conductive sponge adhesive tape stacked in the pasting area to the end face, deviating from the bottom film and located in the pasting area, of the conductive adhesive tape. The process of the invention has the effect of high conductive sponge pasting processing efficiency.

Description

technical field [0001] The present application relates to the technical field of conductive tape processing, in particular to a conductive material forming process. Background technique [0002] Conductive tape is a kind of metal foil or conductive cloth with high conductive adhesive. Its conductive adhesive and conductive substrate form a complete conductor, which can be bonded to any metal surface to complete electrical lapping and electrical sealing of gaps. , Conductive tape combines the softness of cloth and the high conductivity of conductive media, and is widely used in many consumer electronics products such as plasma TVs, liquid crystal displays, mobile phones, laptop computers, and desktop computers. [0003] At present, in order to have a better load-bearing performance of the conductive tape, a layer of conductive sponge is generally pasted on the conductive tape manually, so that the conductive tape has a height difference, which is convenient for carrying objec...

Claims

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Application Information

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IPC IPC(8): H01B13/00
CPCH01B13/00
Inventor 郑珠凤郑光灿
Owner 东莞市绿辉智能科技有限公司
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