Integrated device

Abstract

The invention relates to the technical field of circuit board manufacturing, and particularly discloses an integrated device, which comprises two circuit board assemblies arranged in a spaced mode, wherein a connector is arranged between the two circuit board assemblies and comprises an insulator, a plurality of first electric conductors are arranged on the side face, close to the circuit board assemblies, of the insulator, one side faces, close to the connector, of the circuit board assemblies are provided with bonding pads which are opposite to the first electric conductors in number and correspond to the first electric conductors in position, the first electric conductors abut against the bonding pads to achieve electric conduction, the two first electric conductors on the two opposite side faces of the insulator are electrically conducted through a first conducting medium, a hot melting column is arranged on the insulator in a protruding mode, a through hole for the hot melting column to pass through is formed in the circuit board assembly in a penetrating mode, the end of the hot melting column penetrates through the through hole and then is hot-melted to form a limiting part, and the limiting part abuts against the side face, away from the connector, of the circuit board assembly. The integrated device is detachable, low in maintenance cost and good in conductivity.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an integrated device. Background technique [0002] In the electronics industry, electronic components such as chips and circuit boards are usually connected by soldering (BGA) or conductive glue. Although welding has the advantage of reliable connection, it also has the disadvantage of being unable to be disassembled repeatedly. If there is an operation error during the welding process, or there is a problem such as poor electrical conductivity after welding, the electronic components that are welded can only be reworked or directly reworked with more resources. scrapped, resulting in material waste and cost increase; although conductive adhesive connection is easier to implement than welding, and is convenient for rework and maintenance, due to some problems of conductive adhesive itself, as well as external factors such as climate, aging, stress and strain,...

AI Technical Summary

Problems solved by technology

Although welding has the advantage of reliable connection, it also has the disadvantage of not being able to be disassembled repeatedly. If there is an operation error in the welding process, or poor electrical conductivity after welding, the soldered electronic components can only spend more resources on rework or direct scrapped, resulting in material waste and cost increase; although conductive adhesive connection is easier to implement than welding, and is convenient for rework and maintenance, due to some problems of conductive adhesive itself, as well as external factors such as climate, aging, stress and strain, etc. Influence, the conductivity of the conductive adhesive is not stable enough, therefore, the problem of circuit interruption or signal distortion is prone to occur between electronic components connected by conductive adhesive

Images