Lifting device and semiconductor process equipment

A process equipment and semiconductor technology, applied in semiconductor/solid-state device manufacturing, metal material coating process, vacuum evaporation plating, etc., can solve the problems affecting the precision of the preparation process, the deviation of the position of the substrate, and the concentricity of the substrate, etc. Achieve the effect of improving the precision of the preparation process and ensuring the concentricity

Active Publication Date: 2021-07-02
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of lifting and lowering the substrate in the magnetron sputtering equipment in the related art, the substrate is

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lifting device and semiconductor process equipment
  • Lifting device and semiconductor process equipment
  • Lifting device and semiconductor process equipment

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] Next, the technical scheme in the present application will be clear and completely, and the embodiments described herein are described herein, and not all of the embodiments of the present disclosure, not all of the embodiments of the present application. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative labor, are the scope of the present application.

[0030] The terms "first", "second", and the like in the specification of the present application are used to distinguish between similar objects, not to describe a particular order or ahead order. It is to be understood that the data such as use can be interchanged in appropriate, so that the embodiments of the present application can be implemented in the order other than those illustrated or described herein, and "first", "second", etc. Objects are usually a class, and the number of objects is not limited, such as one of the first object, or...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a lifting device and semiconductor process equipment, and relates to the field of semiconductor manufacturing. The lifting device is the lifting device of a base in the semiconductor process equipment, is used for driving the base to lift in a process chamber, and comprises a lifting mechanism and a translation mechanism. The translation mechanism comprises a supporting part, a first sliding plate, a second sliding plate and a mounting plate which are stacked, an adjusting assembly is connected with the supporting plate and the mounting plate, the mounting plate is fixed to the process chamber, the first sliding plate is slidably connected to the supporting plate in the first direction, and the second sliding plate is slidably connected to the first sliding plate in the second direction. A sliding sleeve extending in the third direction is arranged on the second sliding plate. The lifting mechanism comprises a lifting shaft, and the lifting shaft is arranged in the sliding sleeve in a sliding mode. The semiconductor process equipment comprises the lifting device. The device at least can relieve the problem of substrate position deviation.

Description

technical field [0001] The application belongs to the technical field of semiconductors, and in particular relates to a lifting device and semiconductor process equipment. Background technique [0002] Magnetron sputtering or sputtering (Sputtering) deposition technology is a kind of physical vapor deposition (Physical Vapor Deposition, PVD), is the most widely used type of thin film manufacturing technology in the semiconductor industry, generally refers to the use of physical methods to prepare thin films Preparation Process. Usually, the above thin film preparation process uses magnetron sputtering equipment. However, in the process of lifting and lowering the substrate in the magnetron sputtering equipment in the related art, the substrate is prone to position deviation, which affects the concentricity of the substrate, thereby affecting the precision of the manufacturing process. Contents of the invention [0003] The purpose of the embodiments of the present applic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23C14/50C23C14/54H01L21/687
CPCC23C14/50C23C14/54H01L21/68742
Inventor 赵康宁
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap