Multi-path server node cross-board signal interconnection device

A multi-channel server and node single board technology, applied in the server field, can solve problems such as the inability to meet quick dismantling and hot maintenance and replacement, the large number of cable layouts, and restrictions on the layout of multi-node single boards

Active Publication Date: 2021-07-02
SHANDONG YINGXIN COMP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to ensure low signal loss and fast transmission rate, the use of cable solutions can meet this requirement to a certain extent. However, if only cables are used for signal interconnection, the cable T

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  • Multi-path server node cross-board signal interconnection device
  • Multi-path server node cross-board signal interconnection device
  • Multi-path server node cross-board signal interconnection device

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] Please refer to figure 1 , figure 1 It is a schematic diagram of the overall structure of a specific embodiment provided by the present invention.

[0030] In a specific embodiment provided by the present invention, the multi-channel server node cross-board signal interconnection device mainly includes a mid-backplane 1, a first signal connector 2, a second signal connector 3, a signal lead-out terminal 4 and a signal interconnection Cable 5.

[0031...

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Abstract

The invention discloses a multi-path server node cross-board signal interconnection device which comprises: a middle backboard and a plurality of first signal connectors arranged on the surface of the middle backboard; second signal connectors which are arranged on the back surface of the middle back plate, the distribution areas of the second signal connectors being the same as those of the first signal connectors; signal leading-out ends which are arranged on the node single plates and are used for being connected with the second signal connectors; and a plurality of signal interconnection cables which are connected among the second signal connectors. Therefore, each second signal connector realizes signal transmission on the middle back plate through the signal interconnection cable, and each second signal connector and the first signal connector are arranged in the same area, so that the risk of signal interference is eliminated, the occupied mounting space on the surfaces of the two sides of the middle back plate is saved, and quick disassembly, assembly and maintenance are facilitated; and meanwhile, a signal interconnection path is optimized, a signal link does not need to pass through inter-board transmission of the middle and back boards, and the signal interconnection switching level and loss are reduced.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a cross-board signal interconnection device for multi-channel server nodes. Background technique [0002] Traditional server mainboards have more CPUs with 2 channels on a single board, and 4 CPUs on a single board is basically the industry limit. When the key application host requires 8 or more multi-channel products, the only way to realize the series-parallel connection of multiple single boards based on UPI interconnection technology. And based on the 7x24 hours working environment and requirements of key application hosts, it is a higher requirement for 8-channel and above multi-channel products to realize modularization of each node of the key application host and quickly realize signal cross-board interconnection. [0003] In the prior art, multi-node single boards generally implement signal interconnection through a mid-backplane. Since the multi-node single boards are ...

Claims

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Application Information

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IPC IPC(8): H01R24/00H01R13/502H01R12/71G06F13/38G06F1/18
CPCH01R24/00H01R13/502H01R12/716G06F1/183G06F13/385H01R2201/06
Inventor 唐雪飞王宏
Owner SHANDONG YINGXIN COMP TECH CO LTD
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