Multi-path server node cross-board signal interconnection device

Abstract

The invention discloses a multi-path server node cross-board signal interconnection device which comprises: a middle backboard and a plurality of first signal connectors arranged on the surface of the middle backboard; second signal connectors which are arranged on the back surface of the middle back plate, the distribution areas of the second signal connectors being the same as those of the first signal connectors; signal leading-out ends which are arranged on the node single plates and are used for being connected with the second signal connectors; and a plurality of signal interconnection cables which are connected among the second signal connectors. Therefore, each second signal connector realizes signal transmission on the middle back plate through the signal interconnection cable, and each second signal connector and the first signal connector are arranged in the same area, so that the risk of signal interference is eliminated, the occupied mounting space on the surfaces of the two sides of the middle back plate is saved, and quick disassembly, assembly and maintenance are facilitated; and meanwhile, a signal interconnection path is optimized, a signal link does not need to pass through inter-board transmission of the middle and back boards, and the signal interconnection switching level and loss are reduced.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a cross-board signal interconnection device for multi-channel server nodes. Background technique [0002] Traditional server mainboards have more CPUs with 2 channels on a single board, and 4 CPUs on a single board is basically the industry limit. When the key application host requires 8 or more multi-channel products, the only way to realize the series-parallel connection of multiple single boards based on UPI interconnection technology. And based on the 7x24 hours working environment and requirements of key application hosts, it is a higher requirement for 8-channel and above multi-channel products to realize modularization of each node of the key application host and quickly realize signal cross-board interconnection. [0003] In the prior art, multi-node single boards generally implement signal interconnection through a mid-backplane. Since the multi-node single boards are ...

AI Technical Summary

Problems solved by technology

[0005] In order to ensure low signal loss and fast transmission rate, the use of cable solutions can meet this requirement to a certain extent. However, if only cables are used for signal interconnection, the cable The number of cable layouts will be too large, and a large number of cross-node cables will limit the layout of multi-node single boards, which cannot meet the needs of quick disassembly, hot maintenance and replacement

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