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12results about How to "Reduce hierarchy" patented technology

Fin type water cooling, heating and power separation copper substrate and LED module manufacturing method

ActiveCN119486414AReduce thermal resistancestable light outputEngineeringGlass sheet
The invention relates to the technical field of LED lighting source packaging, and particularly discloses a fin-type water-cooling-heating-power separation copper substrate and an LED module manufacturing method, and the method comprises the following steps: S1, selecting a copper plate, and cutting the copper plate; step S2, etching a boss; step S3, attaching the PCB circuit board; s4, shoveling teeth; s5, CNC machining is carried out; s6, boss surface treatment is carried out; step S7, fixing the LED chip; step S8, welding a wire; s9, dotting / powder spraying; step S10, protecting the glass sheet; and step S11, testing and sorting. According to the invention, the traditional packaging substrate is changed, the fins on the copper substrate are in direct contact with the cooling liquid, the level from the LED chip to the radiator is reduced, the heat flow channel is shortened, the heat resistance of the light source is reduced, and more advanced heat conduction materials are adopted, so that the long-term stable and effective light output of the LED light source is ensured; and the heat dissipation structure and the weight of the lighting device can be greatly reduced.
Owner:SHENZHEN GETIAN OPTO-ELECTRONICS CO

Equipment state control method and device, storage medium and electronic device

PendingCN121967393Areduce hierarchyReduce Control LatencyTransmissionControl objectiveDevice status
The invention discloses an equipment state control method and device, a storage medium and an electronic device, and relates to the technical field of smart home, and the equipment state control method comprises the steps: determining the state information of target equipment under the condition that a multi-control switch receives a switch control instruction sent by a target object; based on the obtained state information and a pre-stored target switch address of the load switch, a corresponding equipment control instruction can be generated. And sending the generated equipment control instruction to a load switch to indicate the load switch to control the state of the target equipment based on the received equipment control instruction. The intermediate link of the gateway is removed, so that the data transmission level is reduced by direct communication, the control delay is obviously reduced, the almost instant response is realized, and the overall efficiency is improved.
Owner:HAIER YOUJIA INTELLIGENT TECH (BEIJING) CO LTD

General configuration type distributed control architecture based on real-time high-speed Ethernet technology

The invention relates to the technical field of data transmission, in particular to a general configuration type distributed control architecture based on a real-time high-speed Ethernet technology, which comprises a first module layer and at least two second module layers, the first module layer comprises an EtherCAT Master board card and a CPU (Central Processing Unit) board card; the second module group layer comprises an EtherCAT Master module; the EtherCAT Master board card is connected with the CPU board card through an internal SPI (Serial Peripheral Interface) bus or an internal EtherCAT bus; the EtherCAT Master module is connected with the EtherCAT Master board card through an external EtherCAT bus, and the EtherCAT Master module is connected with the EtherCAT Master board card through an external EtherCAT bus; and the first module layer and the second module layer realize data interaction through the EtherCAT Master module and the EtherCAT Master board card. According to the architecture disclosed by the invention, the high-performance real-time industrial Ethernet technology, namely EtherCAT, is integrated, so that the ultra-high-speed transmission of data in a control system is realized. The EtherCAT ensures the quick issuing of a control instruction and the instant return of feedback information through the extremely low communication delay and the efficient data processing capability of the EtherCAT.
Owner:ENERGY CONSTR TIMES (SHANGHAI) NEW ENERGY STORAGE TECH RES INST CO LTD

Novel double-sided same-color hot reel pipe embroidered sheet and production process thereof

The invention relates to a novel double-sided same-color hot rolling pipe embroidery sheet and a production process thereof, and relates to the field of hot rolling pipes, and the novel double-sided same-color hot rolling pipe embroidery sheet comprises a high-temperature thermosetting resin color layer, a vacuum aluminum plating layer, an aluminum layer connecting resin color layer, a PET layer, an adhesive layer and a shrinkage layer which are arranged in sequence. The production process comprises the following steps: sequentially preparing an aluminum layer connecting resin color layer, a vacuum aluminum plating layer and a high-temperature thermosetting resin color layer on the surface of a PET layer to obtain a layer I; carrying out corona treatment on one side, far away from the color layer, of the I layer and one side, far away from the contraction layer, of the I layer, coating a polyurethane adhesive on the surface of the corona layer of the I layer to obtain an adhesive layer, attaching the surface of the corona layer of the contraction layer to the adhesive layer, and curing to obtain the novel double-sided same-color hot reel pipe embroidery sheet. The double-sided same-color embroidery sheet has the effect of improving the hot rolling performance and the interlayer bonding strength of the hot rolling pipe embroidery sheet, the defective rate can be effectively reduced through the double-sided same-color design, the production process is simplified, and the production efficiency is improved.
Owner:SHANGHAI JINWU IND CO LTD

A load / heat integrated ordered porous sweating composite structure and a preparation method thereof

ActiveCN117698156BImprove carrying capacityreduce hierarchyFiberFlight vehicle
The application relates to the technical field of aircraft thermal protection, and particularly discloses a preparation method of a bearing / heat-proof integrated ordered porous sweating composite structure, which comprises the following steps: preparing a three-dimensional fiber preform, phthalonitrile resin pouring, cutting processing and aluminum wire removal; and the bearing / heat-proof integrated ordered porous sweating composite structure comprises an ordered porous sweating structure, a cooling working medium flow cavity and a cooling working medium storage tank, the ordered porous sweating structure is a bearing part of a component main body, and the ordered porous sweating structure is provided with a micropore flow channel for sweating cooling; the ordered porous composite material sweating structure of the application can have higher bearing capacity while the sweating cooling performance is considered, and the specific strength is far higher than that of the commonly-used metal and ceramic sweating materials; the bearing and sweating structure functions are simultaneously realized; the hierarchical structure of the sweating structure can be reduced, the overall thickness of the sweating system is reduced, and the negative weight of the aircraft is greatly reduced.
Owner:HARBIN INST OF TECH

A flexible high-temperature resistant composite thermal protection component and its manufacturing method

This invention discloses a flexible high-temperature resistant composite thermal protection component and its manufacturing method. The component includes an ablation-resistant layer and a flame-retardant aluminum foil composite fiberglass cloth layer. The ablation-resistant layer is formed by coating a polyester fiber felt with an aerogel impregnation liquid and curing it to form an aerogel felt. The flexible high-temperature resistant composite thermal protection component produced by this invention has excellent aging resistance, is lightweight, and can withstand long-term heat insulation at medium and high temperatures. It can maintain its position for 1100 seconds at an ambient temperature of 230~260℃, while the outer surface temperature of the heat-resistant instrument remains below 55℃.
Owner:HUNAN XINGXIN AETROSPECE NEW MATERIAL CO LTD

Connected domain marking circuit, chip, processor and method

ActiveCN119131558AMany levelsreduce hierarchyCharacter and pattern recognitionFinal LabelingProcessing element
The invention discloses a connected domain marking circuit, a chip, a processor and a method, and relates to the technical field of chips. The connected domain marking circuit comprises m processing unit arrays and a label processing module, the m processing unit arrays are used for acquiring an input pixel vector, and the width corresponding to the ith sub-pixel vector in the input pixel vector is the same as the width of the ith processing unit array in the m processing unit arrays; the ith processing unit array is used for carrying out label distribution on the ith sub-pixel vector to obtain temporary labels respectively corresponding to each pixel in the ith sub-pixel vector; the label processing module is used for merging the temporary labels corresponding to the pixels in the m sub-pixel vectors to obtain final labels corresponding to the pixels in the input pixel vector, and the final labels are used for obtaining connected domains in the input pixel vector. And the marking efficiency of the connected domain is improved.
Owner:TENCENT TECHNOLOGY (SHENZHEN) CO LTD

Linkage type automatic swinging material distributing machine structure

The utility model relates to the technical field of material distributors, and discloses a linkage type automatic swinging material distributor structure. The linkage type automatic swing distributing machine structure comprises a machine frame, a conveyor, a rotating shaft, a sliding block or a rolling wheel, a sliding rail or a rail, a long arm, a short arm and a rotating power mechanism, according to the linkage type automatic swing distributing machine structure, a single-stage rotating power mechanism is adopted for replacing multi-stage gear transmission, the number of transmission chain layers is reduced, the self weight of equipment is reduced, and the structure is simple; the installation space is small, the number of moving parts is reduced, the failure rate is reduced, the maintenance cost is reduced, energy consumption is reduced, and energy is saved.
Owner:SHANDONG HENRY FOOD MASCH CO LTD

Network optimization method for power line carrier communication system

The invention relates to the technical field of network optimization, in particular to a network optimization method for a power line carrier communication system, which comprises the following steps of: intelligently dividing communication areas to ensure the optimal communication quality among nodes in the same communication area and reduce signal interference and attenuation; impedance matching is completed in the same communication area, channel attenuation is reduced, network configuration is dynamically adjusted according to a network link communication quality matrix, and it is ensured that the network is always in the optimal state; by optimizing and reconfiguring the proxy sites in the industrial automation network, the delay and loss in the data transmission process can be reduced, so that the expansibility and flexibility of the network are ensured; the overall efficiency and stability of the network are improved by analyzing the network hierarchical structure and the traffic demand, formulating a load balancing strategy, optimizing the network hierarchy and reducing unnecessary nodes and links. The invention is used for solving the technical problem of insufficient optimization of industrial automation network communication in the existing scheme.
Owner:AEROSPACE CPOWER SCI & TECH (CHONGQING) LTD

Data searching method and device and computer equipment

The invention relates to a data searching method and device and computer equipment. The method comprises the following steps: in response to a search instruction of target difference data, obtaining a device identifier carried in the search instruction and a data version range corresponding to the target difference data, and querying position identifier information corresponding to the target difference data in a pre-generated data organization structure according to the device identifier and the data version range, the target difference data is searched according to the position identification information, and the data organization structure is a multi-level structure formed based on different device identifications, data versions under different devices and the position identification information of the difference data between the data versions. According to the method, due to the fact that the data organization structure is a multi-level structure, useless information can be avoided in the query process, the amount of data traversed in the query process can be reduced, the query speed and efficiency of the position identification information can be improved, and the search speed and efficiency of the target difference data can be further improved.
Owner:SUGON INFORMATION IND +1

A hierarchical topology domain weight-aware task scheduling method and system

ActiveCN121597348BImprove training efficiencyComputing power balanceResource allocationTransmissionDomain modelDomain level
The application discloses a kind of hierarchical topology domain weight-aware task scheduling method and system, the method includes: based on the network bandwidth difference between node performance and inter-node modeling, obtain the hierarchical cluster node performance topology domain model with weight, can reflect the network bandwidth difference between node performance and inter-node.Resource scheduling process, task specifies topology domain level, scheduler traverses all nodes of each topology domain under this level and carries out two stages of preselection and optimization, finally selects a best node, and the node is distributed to the node, and the scheduling result is recorded;If multiple topology domains meet the requirements, the node resources preferred by the Pod distributed in each topology domain are added, and the binding request is sent according to the highest score of the topology domain scheduling result, and the specific binding action is responsible by kubelet.The application considers the network bandwidth difference between node performance and inter-node, can schedule workload to the best performance domain, and improve the efficiency of large model training.
Owner:ZHEJIANG LAB

HEMT (High Electron Mobility Transistor) integrated luminous chip, preparation method thereof, epitaxial wafer and display backboard

PendingCN122002991AImprove migration efficiencyIncrease the amount of lightQuantum wellCommon drain
The invention discloses an HEMT integrated light-emitting chip and a preparation method thereof, an epitaxial wafer and a display backboard, the HEMT integrated light-emitting chip comprises an N-type semiconductor layer, an intrinsic semiconductor layer, a first quantum well layer and a second quantum well layer which are stacked in sequence from bottom to top, the first quantum well layer and the second quantum well layer are different in light-emitting color, and the energy band widths of the first quantum well layer and the second quantum well layer are reduced in sequence; the second quantum well layer is arranged on the second light-emitting area on the first quantum well layer, barrier layers and P-type semiconductor layers which are stacked in sequence are arranged on the first light-emitting area on the first quantum well layer and the second quantum well layer, and source electrodes are correspondingly arranged on the P-type semiconductor layers; each barrier layer is provided with a grid electrode which is arranged at an interval with the P-type semiconductor layer; the N-type semiconductor layer is provided with a common drain electrode which is connected with the N-type semiconductor layer and penetrates through the electrode hole. The HEMT integrated light-emitting chip manufactured through the method is more compact in structure, high in dimming capacity and higher in light-emitting efficiency, and single-color and double-color display is achieved.
Owner:CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD