6results about How to "Reduce hierarchy" patented technology

The invention discloses an equipment state control method and device, a storage medium and an electronic device, and relates to the technical field of smart home, and the equipment state control method comprises the steps: determining the state information of target equipment under the condition that a multi-control switch receives a switch control instruction sent by a target object; based on the obtained state information and a pre-stored target switch address of the load switch, a corresponding equipment control instruction can be generated. And sending the generated equipment control instruction to a load switch to indicate the load switch to control the state of the target equipment based on the received equipment control instruction. The intermediate link of the gateway is removed, so that the data transmission level is reduced by direct communication, the control delay is obviously reduced, the almost instant response is realized, and the overall efficiency is improved.

The application relates to the technical field of aircraft thermal protection, and particularly discloses a preparation method of a bearing / heat-proof integrated ordered porous sweating composite structure, which comprises the following steps: preparing a three-dimensional fiber preform, phthalonitrile resin pouring, cutting processing and aluminum wire removal; and the bearing / heat-proof integrated ordered porous sweating composite structure comprises an ordered porous sweating structure, a cooling working medium flow cavity and a cooling working medium storage tank, the ordered porous sweating structure is a bearing part of a component main body, and the ordered porous sweating structure is provided with a micropore flow channel for sweating cooling; the ordered porous composite material sweating structure of the application can have higher bearing capacity while the sweating cooling performance is considered, and the specific strength is far higher than that of the commonly-used metal and ceramic sweating materials; the bearing and sweating structure functions are simultaneously realized; the hierarchical structure of the sweating structure can be reduced, the overall thickness of the sweating system is reduced, and the negative weight of the aircraft is greatly reduced.

This invention discloses a flexible high-temperature resistant composite thermal protection component and its manufacturing method. The component includes an ablation-resistant layer and a flame-retardant aluminum foil composite fiberglass cloth layer. The ablation-resistant layer is formed by coating a polyester fiber felt with an aerogel impregnation liquid and curing it to form an aerogel felt. The flexible high-temperature resistant composite thermal protection component produced by this invention has excellent aging resistance, is lightweight, and can withstand long-term heat insulation at medium and high temperatures. It can maintain its position for 1100 seconds at an ambient temperature of 230~260℃, while the outer surface temperature of the heat-resistant instrument remains below 55℃.

The utility model relates to the technical field of material distributors, and discloses a linkage type automatic swinging material distributor structure. The linkage type automatic swing distributing machine structure comprises a machine frame, a conveyor, a rotating shaft, a sliding block or a rolling wheel, a sliding rail or a rail, a long arm, a short arm and a rotating power mechanism, according to the linkage type automatic swing distributing machine structure, a single-stage rotating power mechanism is adopted for replacing multi-stage gear transmission, the number of transmission chain layers is reduced, the self weight of equipment is reduced, and the structure is simple; the installation space is small, the number of moving parts is reduced, the failure rate is reduced, the maintenance cost is reduced, energy consumption is reduced, and energy is saved.

The application discloses a kind of hierarchical topology domain weight-aware task scheduling method and system, the method includes: based on the network bandwidth difference between node performance and inter-node modeling, obtain the hierarchical cluster node performance topology domain model with weight, can reflect the network bandwidth difference between node performance and inter-node.Resource scheduling process, task specifies topology domain level, scheduler traverses all nodes of each topology domain under this level and carries out two stages of preselection and optimization, finally selects a best node, and the node is distributed to the node, and the scheduling result is recorded;If multiple topology domains meet the requirements, the node resources preferred by the Pod distributed in each topology domain are added, and the binding request is sent according to the highest score of the topology domain scheduling result, and the specific binding action is responsible by kubelet.The application considers the network bandwidth difference between node performance and inter-node, can schedule workload to the best performance domain, and improve the efficiency of large model training.

The invention discloses an HEMT integrated light-emitting chip and a preparation method thereof, an epitaxial wafer and a display backboard, the HEMT integrated light-emitting chip comprises an N-type semiconductor layer, an intrinsic semiconductor layer, a first quantum well layer and a second quantum well layer which are stacked in sequence from bottom to top, the first quantum well layer and the second quantum well layer are different in light-emitting color, and the energy band widths of the first quantum well layer and the second quantum well layer are reduced in sequence; the second quantum well layer is arranged on the second light-emitting area on the first quantum well layer, barrier layers and P-type semiconductor layers which are stacked in sequence are arranged on the first light-emitting area on the first quantum well layer and the second quantum well layer, and source electrodes are correspondingly arranged on the P-type semiconductor layers; each barrier layer is provided with a grid electrode which is arranged at an interval with the P-type semiconductor layer; the N-type semiconductor layer is provided with a common drain electrode which is connected with the N-type semiconductor layer and penetrates through the electrode hole. The HEMT integrated light-emitting chip manufactured through the method is more compact in structure, high in dimming capacity and higher in light-emitting efficiency, and single-color and double-color display is achieved.