Alarm for preventing misjudgment of sensor and judgment method thereof
A sensor and alarm technology, which is applied in the sensor field, can solve the problems of increasing the size of the sensor, increasing the difficulty of the sensor circuit board process, and inability to adjust the signal.
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Embodiment 1
[0051] The present embodiment is an example of the thermal release electrophilic infrared sensor KP500B mounted on the elevator;
[0052] Establish a data connection with the sensor to obtain the work data of the sensor;
[0053] In particular, the alarm is established with the sensor with the sensor by wireless or wired, and how the wireless or wired manner includes, but is not limited to, WiFi or network cable, including but not limited to model sub-information. And work information;
[0054] Exemplary, the alarm creates a data connection with the sensor through the network cable, and acquires the type subsystem information and the workman information, where the model subsystem includes all model information of the sensor, such as the model of the thermal release infrared sensor KP500B, including: Model : KP500B; Package: TO-5; sensitive element area: 2.0mmdual, dual element; substrate material: silicon Si; window size: 4 × 3mm; substrate thickness: 0.5mm;
[0055] Working infor...
Embodiment 2
[0096] This embodiment is an example of a thermal release electrophilic infrared sensor KP500B mounted in an electric escalator;
[0097] Establish a data connection with the sensor to obtain the work data of the sensor;
[0098] In particular, the alarm is established with the sensor with the sensor by wireless or wired, and how the wireless or wired manner includes, but is not limited to, WiFi or network cable, including but not limited to model sub-information. And work information;
[0099]Exemplary, the alarm creates a data connection with the sensor through the network cable, and acquires the type subsystem information and the workman information, where the model subsystem includes all model information of the sensor, such as the model of the thermal release infrared sensor KP500B, including: Model : KP500B; Package: TO-5; sensitive element area: 2.0mmdual, dual element; substrate material: silicon Si; window size: 4 × 3mm; substrate thickness: 0.5mm;
[0100] Working inform...
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