A kind of high-frequency high-speed PCB board for 5G base station and its manufacturing method

Abstract

The invention discloses a high-frequency and high-speed PCB board for a 5G base station, which includes a combined PCB main body, a power consumption element, and a heat conduction part, wherein the combined PCB main body includes a plurality of inner core boards stacked on each other, and is arranged between the inner core boards. The heat dissipation layer is used to improve the heat dissipation performance of the inner core board. The power dissipation element is arranged on the surface of the composite PCB body, and a thermal conduction hole is opened on the composite PCB body where the power dissipation element is located. The heat conduction part is embedded in the heat conduction hole. By laminating the single-layer inner core board and heat dissipation into a multi-layer PCB board, the frequency of the PCB board is increased, and the interlayer heat dissipation layer is used to dissipate heat from the inner core board, and the combined PCB under the power dissipation components The heat conduction hole is set on the main body and embedded in the heat conduction part. Through the heat conduction part, the heat emitted by the power consumption components is conducted and dissipated to improve the heat dissipation performance of the PCB board, thereby satisfying the functions of the PCB board and at the same time improving the heat dissipation performance of the PCB board. Better, thereby improving the service life of the PCB board.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a high-frequency and high-speed PCB board for 5G base stations and a manufacturing method thereof. Background technique [0002] PCB board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. The existing PCB board mainly adopts a single-layer structure, but the frequency of a single-layer PCB board is low, which cannot meet the high-frequency and high-speed requirements of today's 5G base stations. The technology usually combines the original single-layer PCB board into multiple layers to improve the function of the PCB board. However, improving the function of the PCB board also makes the heat dissipation capacity of the multi-layer PCB board poor, resulting in a higher temper...

AI Technical Summary

Problems solved by technology

[0003] An object of the present invention is to provide a high-frequency and high-speed PCB board for 5G base stations, which is used to solve the poor heat dissipation effect of the existing multi-layer PCB board, which causes the components on the PCB board to be easily damaged and the service life of the PCB board is relatively short. question

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