OLED substrate packaging method and device thereof

Abstract

The invention discloses an OLED substrate packaging device, a heating disc, a bell jar is provided on the top of the heating disc, a supporting member for supporting the heating disc is provided on the outside of the heating disc, and a connecting member is provided at the bottom of the heating disc. , the substrate is fixedly installed on the bottom of the heating disk through the connecting piece; the driving piece that drives the heating disk to rotate is arranged above the support piece; the support frame is connected under the side of the support piece, and the method for encapsulating the OLED substrate and its device, use the pressure roller in the leveling device to support the surface of the substrate when the substrate is vapor-deposited, so as to avoid wrinkles in the substrate during the heating and vapor-deposition process, resulting in unqualified substrate evaporation, and the knurled pressure roller can reduce The contact surface between the pressure wheel and the substrate, during the rotation evaporation process of the substrate, the pressure wheel also keeps rotating relative to the substrate, so as to avoid interference and shielding of the evaporation surface of the substrate by the pressure wheel, so that the surface of the substrate can be uniformly evaporated.

Description

technical field [0001] The invention relates to the technical field of OLED substrate packaging, in particular to an OLED substrate packaging method and a device thereof. Background technique [0002] In recent years, with the development of flexible screen technology, the application of flexible OLED display has become more and more extensive. OLED display is a display made of organic light-emitting diodes. Since organic light-emitting diodes can emit light by themselves, they do not need a backlight. And it has excellent characteristics such as high contrast, thin thickness, wide viewing angle, fast response, flexibility, wide temperature range, simple structure and manufacturing process, etc. It is considered to be an emerging application technology of the next generation of flat-panel displays. The material is special and easily reacts with water and oxygen, so each plate needs to be encapsulated with a protective film during preparation. [0003] In the OLED substrate ...

AI Technical Summary

Problems solved by technology

[0004] The greater the deformation of the substrate, that is, the greater the deflection of the deformation due to gravity, the emergence of this problem makes the evaporation of organic materials more difficult. When the deformation is too large, it is easy to evaporate organic materials on the substrate when the substrate is placed horizontally. Wrinkle organic materials, damage the organic light-emitting layer and various functional layers, resulting in low yield and increased production costs, directly affecting the competitiveness of products and the market

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