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Feeding equipment for wafer mounting

A feeding equipment and placement technology, which is applied in transportation and packaging, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as complex structures, improve work efficiency, ensure balance, and reduce occupied space.

Pending Publication Date: 2021-07-23
东莞市鹰眼在线电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings and deficiencies in the prior art, the present application aims to solve the problem of the complex structure of the wafer mounting and feeding equipment in the prior art center

Method used

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  • Feeding equipment for wafer mounting
  • Feeding equipment for wafer mounting
  • Feeding equipment for wafer mounting

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0025] see Figure 1 to Figure 2 , the present application provides a wafer mounting and feeding equipment 1 including a base 10, the base 10 has a head end 11 and a tail end 12; a film expanding device 20 is liftably connected to the tail end 12; The upper platen assembly 30, the upper platen assembly 30 is arranged on the base 10; the film carrier 50, the film carrier 50 is slidably connected to the upper platen assembly 30; the clamping device 40, the clamping The...

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Abstract

The invention provides feeding equipment for wafer mounting. The feeding equipment for wafer mounting comprises: a base, wherein the base is provided with a head end and a tail end; a film expanding device, which is connected to the tail end of the base in a lifting manner; an upper pressing plate assembly, which is arranged on the base; a film carrier, which is connected to the upper pressing plate assembly in a sliding mode; and a clamping device, which is connected to the base in a sliding mode and slides back and forth from head end to tail end. According to the invention, a grabbing device, the film expanding device and the upper pressing plate assembly are arranged to be of the integrated structure, so the grabbing device can move and shuttle between the upper pressing plate assembly and the film expanding device, the problem that the upper pressing plate assembly needs to be opened for discharging is avoided, the balance of film expanding tension is guaranteed, the problem of external design of the clamping device in a traditional design is solved, the occupied space of the grabbing device is reduced, and the working efficiency of the feeding equipment for wafer mounting is improved.

Description

technical field [0001] The invention relates to a feeding device, in particular to a wafer mounting feeding device. Background technique [0002] In the prior art, the automatic feeding of wafer mounting is operated by the external clamping and discharging mode, and a gap will be opened on the wafer platen for the clamping device to enter and exit. When the wafer is expanding the film, the platen is pressed down and When the expansion ring interacts to expand the film, the expansion tension of the crystal ring blue film at the gap is unbalanced, which affects the expansion yield, and the clamping and discharging device needs to be external, which increases the space occupied by the equipment. Contents of the invention [0003] In order to overcome the disadvantages and deficiencies in the prior art, the present application aims to solve the problem of complex structure of the center wafer mounting and feeding equipment in the prior art. [0004] The application provides a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67121H01L21/67742
Inventor 陈鸣陈洁丁晓华周翔
Owner 东莞市鹰眼在线电子科技有限公司
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