Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Three-dimensional reconstruction method and device, electronic equipment and computer storage medium

A technology of three-dimensional reconstruction and three-dimensional map, applied in the fields of electronic equipment and computer storage media, three-dimensional reconstruction methods and devices, can solve problems such as low efficiency, and achieve the effect of improving efficiency

Active Publication Date: 2021-07-27
杭州易现先进科技有限公司
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present application provide a 3D reconstruction method, device, electronic equipment, and computer storage medium to at least solve the problem of low efficiency in 3D reconstruction of large-scale scenes in related technologies

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional reconstruction method and device, electronic equipment and computer storage medium
  • Three-dimensional reconstruction method and device, electronic equipment and computer storage medium
  • Three-dimensional reconstruction method and device, electronic equipment and computer storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0042]Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application, and those skilled in the art can also apply the present application to other similar scenarios. In addition, it can also be understood that although such development efforts may be complex and lengthy, for those of o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a three-dimensional reconstruction method and device, electronic equipment and a computer storage medium, and the method comprises the steps: calculating the relative pose similarity transformation between all SFM models in a topological relation graph which is the spatial position priori obtained when an image set is collected, obtaining each SFM model by performing three-dimensional reconstruction on each image set of the large-scale scene blocks based on an SFM algorithm; processing the topological relation graph to obtain a maximum spanning tree, wherein the maximum spanning tree is a subset of the topological relation graph; and finding a node with the maximum degree in the maximum spanning tree as a root node, performing similarity transformation on the SFM models on other nodes by taking the root node as a reference coordinate system so as to unify coordinate systems of the plurality of SFM models and obtain a combined target three-dimensional map, and performing global optimization on the pose map to obtain an optimized target three-dimensional map. According to the invention, the problem of low efficiency of three-dimensional reconstruction of a large-scale scene is solved.

Description

technical field [0001] The invention relates to the field of computer vision computing, in particular to a three-dimensional reconstruction method, device, electronic equipment and computer storage medium. Background technique [0002] Using traditional SFM (Structure From Motion, also known as recovering structure from motion) technology, visual 3D reconstruction of a scene is divided into the following steps: 1. Image feature point extraction; 2. Pairwise image matching and geometric calibration 3. Feature point tracking of multiple images; 4. Triangulation of two / multiple images; 5. Global BA (Bundle Adjustment, also known as bundle adjustment) optimization of multiple images. In related technologies, three-dimensional reconstruction is performed on large-scale scenes such as city-level aerial images, by defining matching weights for feature point matching numbers between multiple images of large-scale scenes, and then using a normalized cutting algorithm to perform three...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06T17/00G06T17/05G06T7/73
CPCG06T17/005G06T17/05G06T7/75
Inventor 王成丛林
Owner 杭州易现先进科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com