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Array substrate and micro light-emitting diode display panel

A technology for light-emitting diodes and array substrates, which is used in identification devices, instruments, semiconductor devices, etc., can solve the problems of scratches and short circuits on the substrate, and scratches on the metal layer easily, and achieves the effect of preventing scratches and avoiding scratches and short circuits.

Inactive Publication Date: 2021-07-30
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides an array substrate and a micro-LED display panel, which can solve the problem that the metal layer in the existing array substrate and the micro-LED display panel is easily scratched, causing the substrate to be scratched and short-circuited.

Method used

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  • Array substrate and micro light-emitting diode display panel
  • Array substrate and micro light-emitting diode display panel
  • Array substrate and micro light-emitting diode display panel

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Experimental program
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Effect test

Embodiment 1

[0037] see figure 1 , the embodiment of the present application provides an array substrate 10, the array substrate 10 includes a first area AA for arranging micro light emitting diodes and a second area BB surrounding the first area AA, the array substrate 10 includes: a base 11; The array functional layer on the substrate 11, the array functional layer includes welding terminals 164 arranged in an array, and the welding terminals 164 are used to electrically connect with the micro light emitting diodes; the protective layer 187 arranged on the array functional layer, the protective layer 187 includes the first sub- The protection layer 18 and the second sub-protection layer 17 , the second sub-protection layer 17 is disposed on the array function layer, and the first sub-protection layer 18 is disposed on the second sub-protection layer 17 . Wherein, the first sub-protective layer 18 is a metal oxide layer, the second sub-protective layer 17 is an inorganic material layer or...

Embodiment 2

[0055] see image 3 , the embodiment of the present application provides an array substrate 10, the array substrate 10 includes a first area AA for arranging micro light emitting diodes and a second area BB surrounding the first area AA, the array substrate 10 includes: a base 11; The array functional layer on the substrate 11, the array functional layer includes welding terminals 164 arranged in an array, and the welding terminals 164 are used to electrically connect with the micro light emitting diodes; the protective layer 187 arranged on the array functional layer, the protective layer 187 includes the first sub- The protection layer 18 and the second sub-protection layer 17 , the second sub-protection layer 17 is disposed on the array function layer, and the first sub-protection layer 18 is disposed on the second sub-protection layer 17 . Wherein, the first sub-protective layer 18 is a metal oxide layer, the second sub-protective layer 17 is an inorganic material layer or...

Embodiment 3

[0071] see Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , image 3 , illustrates a manufacturing process of the array substrate 10 in the second embodiment, but the array substrate 10 can also be manufactured using other processes or photomask sequences, which is not limited here.

[0072] Specifically, a manufacturing process of the array substrate 10 in Embodiment 2 includes: a first photomask, such as Figure 4 As shown, a first metal layer 12 is formed on a substrate 11, and the first metal layer 12 is patterned to include a gate 121 and a first electrode 122; the second photomask, such as Figure 5 As shown, a gate insulating layer 13 is formed on the first metal layer 12, an active layer 145 is formed on the gate insulating layer 13, the upper surface of the active layer 145 is doped, and the active layer 145 can be amorphous silicon or metal oxide, the active layer 145 includes a first sub-active layer 14 and a second sub-active layer 15, and a first ...

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Abstract

The embodiment of the invention discloses an array substrate and a micro light-emitting diode display panel. The array substrate comprises a first area used for arranging micro light-emitting diodes and a second area surrounding the first area. The array substrate comprises a substrate; an array function layer which is arranged on the substrate and comprises welding terminals arranged in an array mode and used for being electrically connected with the micro light-emitting diodes; and a protective layer which is arranged on the array function layer and comprises a first sub-protective layer and a second sub-protective layer, the second sub-protective layer being arranged on the array function layer, and the first sub-protective layer being arranged on the second sub-protective layer. The first sub-protective layer is a metal oxide layer, the second sub-protective layer is an inorganic material layer or an organic material layer, and a through hole is formed in the part, located in the first area, of the protective layer to expose the corresponding welding terminal, so that the scratch resistance of the array substrate can be improved, and the problem of metal short circuit caused by substrate scratch is avoided.

Description

technical field [0001] The present application relates to the display field, in particular to an array substrate and a micro light emitting diode display panel. Background technique [0002] Micro-LED display panels (Micro-LED panels, Mini-LED panels) have developed into one of the hot spots of future display technology. Compared with current LCD and OLED display devices, they have fast response, high color gamut, high PPI, and low energy consumption. and other advantages. The glass substrate benefits from its excellent flatness, and at the same time, the drive lines of active Mini LED and active Micro-LED (AMMini-LED, AM Micro-LED) can be prepared by thin-film transistor technology (TFT array process). Technology is developing vigorously. [0003] However, since the metal layer on the glass substrate is very thin (usually less than 1um), the lines on the Mini-LED / Micro-LED substrate are prone to scratches in actual production, causing the problem of substrate scratches an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L27/15G09F9/33
CPCH01L27/1214H01L27/156G09F9/33
Inventor 胡道兵
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD