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A kind of nano two-phase high-entropy alloy thin film and preparation method thereof

A high-entropy alloy, nano-phase technology, applied in metal material coating process, vacuum evaporation coating, coating and other directions, to achieve excellent wear resistance, high toughness wear resistance, improve comprehensive performance and service life. Effect

Active Publication Date: 2021-12-28
SOUTHWEST JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the one-step method of magnetron sputtering to prepare the dual-phase high-entropy alloy thin film formed by the diffusion and precipitation of elements still faces great challenges.

Method used

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  • A kind of nano two-phase high-entropy alloy thin film and preparation method thereof
  • A kind of nano two-phase high-entropy alloy thin film and preparation method thereof
  • A kind of nano two-phase high-entropy alloy thin film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] CuNiTiNbCr nano-dual-phase high-entropy alloy thin films were prepared on 304 stainless steel and Si substrates. The preparation method is as follows:

[0033] (1) Pre-plating treatment

[0034] Put the substrate in acetone, clean it ultrasonically for 15 minutes, then clean it ultrasonically in absolute ethanol for 15 minutes, and finally take it out and dry it with nitrogen gas.

[0035] (2) Plasma glow discharge sputtering cleaning

[0036] Put the substrate treated in step (1) into the high-power pulsed magnetron sputtering chamber, the chamber is not heated, and the intrinsic vacuum is pre-pumped to 2.0×10 -3 Pa; Then, pass Ar gas with a purity greater than or equal to 99.999% into the cavity, the Ar pressure is 3.0Pa, and the substrate is applied with a negative bias of -1500V. At this time, Ar plasma is generated near the substrate, and Ar + The bombardment of the substrate was continued for 20 min under negative bias.

[0037] (3) Deposition of CuNiTiNbCr nan...

Embodiment 2

[0046] In the present embodiment, the matrix is ​​exactly the same as that in Example 1, and CuNiTiNbCr nanometer dual-phase composite film is prepared on the surface of the matrix, and the preparation method is as follows:

[0047] (1) is identical with the step (1) in embodiment 1;

[0048] (2) same as step (2) in embodiment 1;

[0049] (3) Deposition of CuNiTiNbCr nano-dual-phase high-entropy alloy film

[0050] First, the cavity is evacuated to 1×10 -3 Pa~5×10 -3 Pa, then pass in Ar gas, keep the Ar gas flow constant, the flow rate is 40sccm, and maintain the vacuum degree at 1.0Pa by controlling the pumping speed of the vacuum pump; the average power of the five-element splicing target is 8W / cm 2 , applying 0V bias to the substrate, depositing CuNiTiNbCr nanometer dual-phase high-entropy alloy thin film on the substrate surface, the deposition time is 40min.

[0051] (4) is the same as step (4) in Example 1.

[0052] The CuNiTiNbCr nano-dual-phase high-entropy alloy ...

Embodiment 3

[0058] In the present embodiment, the matrix is ​​exactly the same as that in Example 1, and CuNiTiNbCr nanometer dual-phase composite film is prepared on the surface of the matrix, and the preparation method is as follows:

[0059] (1) is identical with the step (1) in embodiment 1;

[0060] (2) same as step (2) in embodiment 1;

[0061] (3) Deposition of CuNiTiNbCr nano-dual-phase high-entropy alloy film

[0062] First, the cavity is evacuated to 1×10 -3 Pa~5×10 -3 Pa, then pass in Ar gas, keep the Ar gas flow constant, the flow rate is 40sccm, and maintain the vacuum degree at 2.5Pa by controlling the pumping speed of the vacuum pump; the average power of the five-element splicing target is 6W / cm 2 , apply -150V bias voltage to the substrate, deposit CuNiTiNbCr nanometer dual-phase high-entropy alloy thin film on the substrate surface, the deposition time is 40min.

[0063] (4) is the same as step (4) in Example 1.

[0064] The CuNiTiNbCr nano-dual-phase high-entropy a...

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Abstract

The invention discloses a preparation method of a nanometer dual-phase high-entropy alloy thin film. The preparation method comprises two steps of substrate pretreatment and high-power pulse magnetron sputtering deposition. Using high-power pulsed magnetron sputtering technology, the splicing target of five metal elements including metal Cu is used as the target material, and high-purity Ar is used as the working gas, and a negative bias is applied to the substrate after pretreatment. A target voltage is applied, and a nanometer dual-phase high-entropy alloy film comprising an FCC matrix phase and a copper-rich BCC nanophase is deposited on the surface of the substrate. The thin film not only reflects the high solid solution strengthening characteristics of the high-entropy alloy thin film, but also introduces a large number of phase interfaces through the precipitation of copper-rich phases, so that it has an interface strengthening mechanism. Its hardness is up to 13GPa, and because of its excellent toughness, it can play a good role in protecting the substrates operating in high-load and high-friction environments, and has good application value.

Description

technical field [0001] The invention relates to the field of high-entropy alloy materials, in particular to a method for preparing a CuNiTiNbCr nanometer dual-phase high-entropy alloy thin film. Background technique [0002] As a branch of high-entropy alloys, high-entropy alloy thin films are similar in concept to high-entropy alloys, that is, they contain five or more elements, and the atomic percentage of each element ranges from 5 to 35%. High-entropy alloy film has excellent properties such as high hardness, high toughness, chemical corrosion resistance, wear resistance and radiation resistance, and is a new type of hard film. These excellent properties make it have broad application prospects in the fields of seawater corrosion, high temperature wear resistance, and accident-tolerant fuel cladding membranes. At present, the preparation methods of high-entropy alloy thin films mainly include magnetron sputtering, multi-arc ion plating, thermal spraying, laser cladding,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/16C23C14/35C22C30/02
CPCC23C14/165C23C14/352C23C14/345C22C30/02
Inventor 姜欣李延涛曾小康刘茂冷永祥
Owner SOUTHWEST JIAOTONG UNIV