Aging test device and method for semiconductor storage product

Abstract

The invention belongs to the field of semiconductor testing, and particularly relates to an aging test device and method for a semiconductor storage product. Aiming at the problem that a test substrate is easy to loosen and the test accuracy is reduced because the test substrate is inconvenient to fix and position in the process of testing a semiconductor storage product by the existing aging test equipment, the following scheme is provided. The device comprises a box body, four fixing feet are fixedly installed at the bottom of the box body, a box door is hinged to one side of the box body, a handle is fixedly installed on the box door, a heating piece is fixedly installed on the inner wall of the top of the box body, a power source is fixedly installed on the top of the box body, and fixing strips are fixedly installed on the inner walls of the two sides of the box body. According to the invention, the test substrate can be fixed and positioned conveniently in the process of testing the semiconductor storage product, so that the test accuracy reduction caused by the looseness of the test substrate can be prevented. The device is simple in structure and convenient to use.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to an aging testing device for semiconductor storage products and a method thereof. Background technique [0002] In order to achieve the qualification rate of semiconductor chips, almost all semiconductor chips are subjected to burn-in tests before leaving the factory. The burn-in test is to provide the necessary system signals for the semiconductor chip to be tested through the semiconductor test board, simulate the working state of the semiconductor chip, accelerate the electrical failure of the semiconductor chip under high temperature or other conditions, and obtain the failure rate of the semiconductor chip within a period of time. Let the semiconductor chip work under a given load state so that the defects appear in a short period of time, so as to obtain the approximate failure rate of the semiconductor chip in the life cycle, and avoid failure in the early sta...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the disadvantages in the prior art that it is inconvenient to fix and position the test substrate during the burn-in test of semiconductor storage products, thus causing the test substrate to be easily loosened and reducing the accuracy of the test. Aging test equipment for semiconductor storage products

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